A wafer defect detecting method

Abstract

The invention relates to a wafer defect detecting method comprising following steps: gradually moving a wafer in order to perform first defect detection on various chip regions of the wafer with a first scanning resolution; dividing the surface of the wafer into multiple detecting regions according to defect distribution information obtained from the first defect detection and setting a defect amount threshold value for each detecting region, wherein the defect amount threshold value is in positive correlation relation to the defect amount of a corresponding detecting region; gradually moving the wafer in order to perform second defect detection on various chip regions of the wafer with a second scanning resolution, wherein the second scanning resolution is less than the first scanning resolution; performing defect correction technology on the wafer if the defect amount of any detecting region exceeds a corresponding defect amount threshold value. The wafer defect detecting method increases the applicability of the wafer defect detecting method in actual technology, substantially increases defect recognition rate and technology efficiency. The wafer defect detecting method has high precision and low cost and is beneficial to popularization in industry field.

Description

technical field [0001] The invention relates to the field of semiconductor processing and manufacturing, and more specifically, to a wafer defect detection method. Background technique [0002] The advanced integrated circuit manufacturing process generally includes hundreds of steps, and a small error in any link will lead to the failure of the entire chip, especially as the critical size of the circuit continues to shrink, the requirements for process control become stricter, so In the production process, in order to find and solve problems in time, optical and electronic defect detection equipment are equipped to carry out online detection of products. [0003] The basic principle of optical and electronic defect detection is to collect the signals of several chips through the equipment, and convert the physical image on the chip into a data image that can be represented by different bright and dark gray scales. A method for detecting defects on a wafer in the prior art ...

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Problems solved by technology

[0005] In the above defect detection method, due to known problems in the production process that do not require special attention, the number of defects in a specific area on the wafer is very high. If we follow the existing detection method and use a defect number threshold to judge Whether to perform subsequent processing on the wafer, each batch of wafers will meet this judgment and be required to undergo subsequent processing. In the case that this process problem does not require special control, it will cause low efficiency of wafer defect detection , or the defects that really need to be dealt with are not detected, resulting in a decrease in process efficiency and an increase in cost

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