Semiconductor device
A semiconductor and chip technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of widening spacing and large size, achieving space suppression, high reliability, and ensuring connection reliability effect
Active Publication Date: 2016-12-21
PANASONIC CORP
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
As a result, the distance between adjacent electrodes 106 increases, and the size of the extended portion 102 for arranging a required number of terminals increases.
Method used
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Comparison scheme
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no. 1 Embodiment approach
[0028] figure 2 (a) to (c) are diagrams schematically showing the configuration of an exemplary semiconductor device 200 according to this embodiment. In particular, figure 2 (a) is a bird's-eye view showing the whole, figure 2 (b) is figure 2 Sectional view under line B-B' in (a), figure 2 (c) is from figure 2 (b) Top view seen from one side of A.
[0029] figure 2 The semiconductor device 200 shown in (a) has a lower first semiconductor chip 1 forming a stacked structure, and an extended portion 2 formed to extend outward from the outer peripheral side wall (side surface) of the semiconductor chip 1 . Connection terminals 4 are provided on the peripheral portion of the upper surface of the semiconductor chip 1 , and a rewiring layer 50 including wiring 51 leading out functions from the connection terminals 4 is formed spanning from the semiconductor chip 1 to the extension portion 2 . An opening 541 is provided on the surface of the rewiring layer 50 in a regio...
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The present invention provides a semiconductor device comprising: a first semiconductor chip; an extended portion on its side surface and connection terminals thereon; and rewiring on the semiconductor chip and the extended portion including wiring joined to the connection terminals and an insulating layer thereon. part; an electrode to which the opening part of the insulating layer located on the surface of the rewiring part is joined to the wiring on the extended part. The electrode is mainly composed of a material having a higher modulus of elasticity than the wiring, and has a joint region where the wiring is joined at the opening and an outer region near the end of the expanded portion. The wiring is continuously extended to the front of the outer area. Accordingly, even when wire bonding is performed on the electrodes on the rewiring layer formed on the extended portion made of elastic material such as resin, physical damage directly below and around the electrodes can be suppressed to a minimum, and it is possible to provide A highly reliable semiconductor device.
Description
technical field [0001] The present disclosure relates to semiconductor devices, and more particularly, to semiconductor devices mounted with wire bonding. Background technique [0002] In systems such as digital televisions and video recorders, the amount of data to be handled has increased dramatically with higher functionality. As a result, an increase in capacity and a high data transfer rate are required in a semiconductor memory mounted in a system. [0003] As a semiconductor device equipped with such a semiconductor memory, there are a system-on-chip (SoC) in which a semiconductor logic circuit chip on which a memory controller is mounted and a memory are integrated into one chip, and a semiconductor logic circuit chip on which a memory controller is mounted and a memory controller. A system-in-package (SiP) in which memory chips are stacked and housed in one package. [0004] Currently, systems using SiPs with relatively low manufacturing costs tend to increase. ...
Claims
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IPC IPC(8): H01L23/12H01L21/60H01L25/065H01L25/07H01L25/18
CPCH01L24/19H01L2224/04105H01L24/20H01L23/3121H01L23/5389H01L25/0657H01L2224/0401H01L2224/04042H01L2224/16145H01L2224/48227H01L2225/0651H01L2225/06513H01L23/49838H01L2224/05569H01L2224/024H01L24/05H01L24/16H01L24/45H01L24/48H01L24/73H01L2224/02375H01L2224/02381H01L2224/0239H01L2224/05155H01L2224/05553H01L2224/05558H01L2224/05624H01L2224/05644H01L2224/05647H01L2224/05664H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/73207H01L2924/18162H01L2224/05572H01L2224/48624H01L2224/48644H01L2224/48647H01L2224/48664H01L2224/48824H01L2224/48844H01L2224/48847H01L2224/48864H01L2224/48724H01L2224/48744H01L2224/48747H01L2224/48764H01L2924/00011H01L2924/10253H01L2924/00H01L2924/01005H01L2924/01033H01L23/49544H01L23/49534H01L23/49579
Inventor 岩濑铁平油井隆
Owner PANASONIC CORP