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A chemical mechanical polishing method, module and device

A chemical mechanical and grinding module technology, applied in grinding devices, grinding/polishing safety devices, grinding machine tools, etc., can solve the problem of reducing chemical mechanical grinding efficiency, inability to flexibly and conveniently execute chemical mechanical grinding process flow, chemical mechanical grinding module High cost and other problems, to achieve the effect of improving the efficiency of chemical mechanical polishing

Active Publication Date: 2016-06-15
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of this, the technical problem solved by the present invention is: the existing chemical mechanical grinding device cannot perform the chemical mechanical grinding process flexibly and conveniently, reduces the chemical mechanical grinding efficiency, and transforms the chemical mechanical grinding process according to the process of the chemical mechanical grinding process. Grinding modules are expensive

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  • A chemical mechanical polishing method, module and device
  • A chemical mechanical polishing method, module and device
  • A chemical mechanical polishing method, module and device

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specific Embodiment 1

[0048] In the present embodiment, the method for carrying out chemical mechanical polishing to each batch of wafers is as follows:

[0049] Provide a batch of wafers to be processed by CMP. First, determine the CMP process of the batch of wafers according to the semiconductor manufacturing process flow of the wafers. In this embodiment, high dielectric coefficient metal gate (HKMG) polishing is used as an example to illustrate The batch of wafers to be processed in the CMP process. That is to say, the metal layer as HKMG has been fabricated on the wafer device surface of this batch of wafer growth devices, and the next step is to use CMP to polish the metal layer surface to make the metal layer planar. In the prior art, the CMP process flow for polishing the surface of the metal layer of HKMG includes three grinding processes and three cleaning processes after grinding, which are as follows: first process: first RotarySlurryCMP, second process: FixedAbrasiveCMP, third Process...

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Abstract

The invention discloses a chemical mechanical grinding method and chemical mechanical grinding modules and devices. Each chemical mechanical grinding device comprises a plurality of chemical mechanical grinding modules of different types. Each chemical mechanical grinding module of one type comprises one or more grinding and cleaning sub devices of the same type, a control sub-module, a wafer input sub-module and a wafer output sub-module. According to chemical mechanical grinding processes to be executed on a wafer, the wafer is placed into the chemical mechanical grinding modules corresponding to all the processes in sequence to be processed, as a result, the chemical mechanical grinding technological processes can be executed flexibly and conveniently, and chemical mechanical grinding efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a chemical mechanical polishing method, module and device. Background technique [0002] In the current semiconductor manufacturing process, chemical mechanical polishing (CMP) process is used in many cases, such as shallow trench isolation (STI) silicon oxide polishing, local interconnect (LI) silicon oxide polishing, LI tungsten polishing, interlayer dielectric (ILD) ) silicon oxide polishing and double Damascus copper polishing, etc. [0003] Schematic diagram of the structure of a chemical mechanical polishing device in the prior art. Such as figure 1 As shown, the chemical mechanical polishing device includes three sets of grinding sub-devices and three sets of post-grinding cleaning sub-devices, that is, grinding sub-devices 1, sub-devices 2 and sub-devices 3, and post-grinding cleaning sub-devices 1, sub-devices 2 and sub-devices 3. In practical applications,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/00B24B37/34B24B55/06
CPCB24B37/00B24B37/005B24B37/345
Inventor 陈枫
Owner SEMICON MFG INT (SHANGHAI) CORP