Powder rotating CVD (chemical vapor deposition) device

Abstract

The invention discloses a powder rotating CVD (chemical vapor deposition) device which comprises a support and a furnace tube fixed on the support, wherein a main electric furnace surrounds the furnace tube; two ends of the furnace tube are connected with a feed gas inlet device, a current-carrying gas inlet device and a waste gas treatment device respectively; a movable rotating shaft is arranged in the furnace tube; a cylindrical reaction chamber is fixed on the rotating shaft and provided with a plurality of stirring blades which extend from the inner wall surface to the axis side and are used for stirring a powder base; and a plurality of thermal couplers are arranged in the rotating shaft. According to the powder rotating CVD device, the reaction chamber rotates in the coating process, further, the stirring blades drive a powder material to turn over continuously, so that the powder surface is uniformly coated, the coating thickness can be controlled by controlling technological parameters such as a rotating period and the like, the surface of powder with any size can be coated, and the powder rotating CVD device is applicable to coating of inorganic substances including metal, nonmetal and ceramic powder.

Description

technical field [0001] The invention relates to chemical vapor deposition, in particular to a powder rotary chemical vapor deposition device. Background technique [0002] The surface modification of powder and the uniform dispersion of the second phase (Nth phase) in the powder have not yet had a unified and effective solution. Most of the existing powder surface modification technologies are based on the chemical coating method, but each technology is limited to the specified coating layer of a specific material, and the output rate is small and the repeatability is low; in addition, the second phase dispersion in the powder has always been All are solved by various mechanical mixing methods. The mixed powder obtained by the mechanical mixing method is macroscopically uniform, but the distribution of microscopic particles is still uneven. [0003] Chemical vapor deposition (Chemical Vapor Deposition, CVD) is a thin film deposition technology that uses chemical reactions t...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method that can uniformly grow the second phase (Nth phase) material on the substrate in different forms in view of the defect that the powder with larger particles cannot be uniformly modified in the prior art. On the powder, so as to realize the uniform mixing of macroscopic and microscopic multiphase powder rotary chemical vapor deposition equipment

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