Electronic equipment and data center
A technology of electronic equipment and heat dissipation device, applied in the field of electronics, can solve the problems of increasing air duct resistance, limiting the aperture ratio of the backplane 1020, reducing the heat dissipation performance of electronic equipment, etc., to achieve the effect of improving heat dissipation capacity
Active Publication Date: 2014-03-26
深圳市新凯来技术有限公司
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Problems solved by technology
[0004] However, with the continuous improvement of system integration, more and more circuits are on the backplane 1020, which will inevitably limit the opening ratio of the backplane 1020.
The limited opening ratio will increase the air duct resistance at the backplane 1020, thereby reducing the heat dissipation performance of the entire electronic device
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[0045] Various exemplary embodiments, features, and aspects of the invention will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
[0046] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.
[0047] In addition, in order to better illustrate the present invention, numerous specific details are given in the specific embodiments below. It will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, means, components and circuits are ...
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The invention discloses electronic equipment and a data center. The electronic equipment comprises an equipment cabinet, a first back panel, at least two first single panels and a first heat radiator device, wherein the first back panel, the first single panels and the first heat radiator are arranged in the equipment cabinet, the equipment cabinet comprises two oppositely arranged lateral walls and a back part used for connecting the two lateral walls, the first back panel is roughly perpendicular to the back part and roughly parallel with the lateral walls, the first single panels are inserted in a first surface of the first back panel, a gap exists between the two adjacent first single panels, and an air inlet or air outlet of the first heat radiation device faces the gap between the two adjacent single panels. Due to the fact that the first heat radiation device can blow air to the first single panels along an air path parallel with the plane of the first back panel, air path resistance is basically avoided in the position of the back panel. The electronic equipment and the data center can effectively improve the heat radiation capacity of the electronic equipment under a forced air cooling method.
Description
technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device and a data center that use forced air cooling to dissipate heat. Background technique [0002] Under the trend of ICT (Information Communication Technology, information communication technology) integration, the bandwidth and speed of electronic equipment continue to increase, and the heat density of electronic equipment is also increasing. This makes it preferable for the electronic equipment adopting the plug-in structure to have a straight air passage, so as to realize forced air cooling. Wherein, the so-called plug-in architecture refers to that a single board in an electronic device is plugged into a backplane. [0003] Usually, in order to achieve forced air cooling, such as Figure 1a , Figure 1b As shown, in the outer frame 1040 of the electronic device: a plurality of single boards 1010 parallel to the horizontal plane are stacked along a dire...
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Inventor 黄涛卢冬明水瑞锋
Owner 深圳市新凯来技术有限公司