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Multi-tiered storage stand device

A multi-layer storage and table device technology, applied in the direction of storage devices, transportation and packaging, conveyor objects, etc., can solve the problems of limiting the utilization rate of manipulators, uneconomical, and reducing the working efficiency of the process chamber, so as to achieve easy implementation and increase production The effect of output and saving the area occupied by equipment

Active Publication Date: 2014-04-02
BEIJING SEVENSTAR ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the single-layer wafer storage device is still used in the equipment, the utilization rate of the manipulator will be limited to a large extent, and the working efficiency of the process chamber will be reduced.
This would be a very uneconomical defect for the highly competitive semiconductor industry

Method used

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  • Multi-tiered storage stand device
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  • Multi-tiered storage stand device

Examples

Experimental program
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Embodiment Construction

[0027] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0028] In this example, see figure 1 , figure 1 It is a schematic diagram of the overall structure of the multi-layer storage platform device of the present invention. As shown in the figure, the multi-layer storage platform device of the present invention includes a leveling base 100 with a double-layered structure at the bottom of the device, and two opposing The connection side plate 200 installed vertically. The inboards of the two connecting side plates 200 are provided with support leg support frames 300 , and the supporting leg support frames 300 are mounted on the inboards of the two connecting side plates 200 in pairs along the height direction. Such a structural design makes it possible to set one or more layers of supporting legs as required.

[0029] see figure 1 A pin hole is processed at the installation and conne...

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Abstract

The invention discloses a multi-tiered storage stand device. A leveling base comprises a lower support plate, an upper adjusting plate, leveling parts, and locking parts, wherein the leveling parts are arranged between the support plate and the adjusting plate and the support plate and the adjusting plate are fixed through the locking parts. Supporting legs form a paired supporting leg support frame for supporting. The adjusting plate is fixedly connected with the supporting leg support frame through a pair of opposing connecting side plate. The supporting leg support frame can be vertically provided with multiple tiers on the inner sides of the connecting side plates. Multiple support legs are arranged on the upper surface of each tier of the supporting leg support frame. The multi-tiered storage stand device has the advantages that wafers can be stored in multiple tiers, availability of manipulators is improved, production yield is increased, the structure is simple, implementation is easy, and equipment area can be saved.

Description

technical field [0001] The present invention relates to a wafer storage device for semiconductor process equipment, more particularly, to a storage table device for semiconductor process equipment that can simultaneously store multi-layer wafers. Background technique [0002] Semiconductor manufacturing is a series of cycles and repetitions of major process steps. Many fabrication processes involve chemical reactions that take place within the process chamber of semiconductor process equipment. Today, the processing of semiconductor wafers usually involves chemical reactions that take place in process chambers. [0003] According to different processing processes, wafers often need to be transported between process chambers of multiple semiconductor process equipment through a wafer transfer system. In the process equipment, the main function of the wafer transfer system is to load the wafers, and all loading and unloading are done by automatic machinery. Wafers are recei...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G1/02B65G49/07H01L21/67
Inventor 李广义王锐廷赵宏宇张豹裴立坤
Owner BEIJING SEVENSTAR ELECTRONICS CO LTD