A chip surface residue blowing device

Abstract

The invention relates to a blowing device for residue on the surface of a chip. The blowing device comprises a hollow blowing pipe, wherein a pipe body is provided with two air pipe supports and an adjustable gas flow meter, a limiting block is fixedly arranged on the pipe body, a positioning needle parallel to the pipe body is connected between one air pipe support and the limiting block, each air pipe support is provided with a fixing groove for fixing, each fixing groove is positioned at one end of the corresponding air pipe support, the other end of each air pipe support is provided with a clamping part, each clamping part is provided with a through groove communicated with an air pipe hole in the corresponding air pipe support, and a screw hole vertical to the air pipe hole, the side face of the limiting block is provided with a positioning needle hole, and the side face of the air pipe support corresponding to the limiting block is also provided with a positioning needle hole. The blowing device can be used for preventing the blowing pipe from shifting or rotating under the condition of machine repair or human factors and effectively blowing away residue or foreigner matters on the surface of the chip, so that the damage to the chip due to the fact that the residue is embedded into a suction nozzle is avoided, and the product percent of pass is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging and testing, in particular to a chip surface residue blowing device. Background technique [0002] During the semiconductor packaging test, the suction nozzle uses the vacuum switch to open and close the chip to absorb the chip under the suction nozzle, and then solder the chip, but there are often some foreign objects on the surface of the chip, which are mainly left after the chip is not cleaned. Silicon slag and some other debris left when handling the chip, most of the foreign matter or silicon slag residue itself is not bonded or fixed with the chip; if the foreign matter or silicon residue on the chip surface cannot be effectively During production, the suction nozzle will hit these foreign objects. In the process of repeatedly grabbing chips and welding chips, the foreign objects are gradually embedded in the suction nozzle, and then when grabbing and welding chips, The hard foreign ...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to: before the chip in the prior art is absorbed by the suction nozzle for soldering, the foreign matter or silicon slag residue on the surface is easy to be adsorbed on the suction nozzle, thereby causing damage to the surface of the chip by the suction nozzle To solve the problem of chip surface residue blowing device, the blowing device can effectively blow away the residue on the chip surface, avoid the damage to the chip caused by the residue embedded in the suction nozzle, and improve the product qualification rate

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