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Improved system for substrate processing

A substrate and integrated circuit technology, applied in the field of improved substrate processing system, can solve the problems of irritation, retinal damage, etc., and achieve the effect of reducing vibration and shortening delay time

Inactive Publication Date: 2014-04-02
ROKKO SYST PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The drawback is that frequent flashes of high intensity light at high speeds can cause irritation, and possible retinal damage events, even at a distance from the processing device

Method used

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  • Improved system for substrate processing
  • Improved system for substrate processing
  • Improved system for substrate processing

Examples

Experimental program
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Embodiment Construction

[0039] figure 1 is a sawing and sorting system 5 according to one embodiment of the invention. System 5 includes sawing section 15 and sorting section 20 , each having different stages to facilitate processing substrates for IC units from input station 10 to output tray 65A, output tray 65B, and output tray 66 .

[0040] The sawing section 15 includes taking the substrate 11 and separating the IC units for placement on trays 22 for transport to the cleaning station 30 using the picker 25 . The separated IC units are rinsed before being placed on the drying plate 35 so as to be subjected to hot air from the hot air hole 40 . forfigure 1 and figure 2 In the present embodiment shown, the drying plate and hot air holes can be conventional drying tables, or alternatively, can be as in Figure 3A to Figure 3C Shown is a drying table according to one embodiment of the present invention.

[0041] The rinsed and dried units are then deposited on the inversion plate 45 and inverted...

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PUM

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Abstract

A method of processing IC units comprising the steps of: dicing the IC units from a substrate; delivering the IC units to a idle block; inspecting a face of the units as exposed during the dicing step using an inspection device whilst the units are on the idle block, then; engaging the units with a picker assembly; passing the units over a second inspection device to inspect an opposed face of the units.

Description

technical field [0001] The invention relates to the processing of substrates for integrated circuits and their subsequent dicing and separation into individual IC units. In particular, the invention relates to the operation of IC units for subsequent processing. Background technique [0002] In integrated circuit cell (IC cell) processing, the cell is fabricated as a substrate for many such cells. The substrate is then diced and separated into individual integrated circuit units, which are delivered to a sorting station for sorting into reject, good or rework categories. [0003] The sorting stage includes inspection of the units to ensure that the slitting and separation stage has not damaged the units, or left debris on them that could affect quality or damage equipment. [0004] To reduce such debris, flush and dry the units before inspection. One such method is to deliver the unit to a drying plate and then subject the unit to a stream of hot air from a heater. The h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/66
CPCH01L21/67703H01L22/12H01L21/67288H01L21/67H01L21/67092B28D5/029H01L22/20H01L21/6838H01L21/67271H01L21/681Y10T83/8742H01L22/00H01L21/78
Inventor 白承昊丁锺才金泰进
Owner ROKKO SYST PTE LTD