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Silicon steel foil for lamination of printed circuit boards and lamination method using the silicon steel foil

A technology for printed circuit boards and circuit boards, applied in the directions of printed circuits, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problems of insufficient FPC bonding force, uneven FPC, affecting the yield of FPC products, etc., to reduce warpage The effect of improving the degree of smoothness, improving the flatness and increasing the service life

Active Publication Date: 2016-07-06
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when pressing a flexible printed circuit board, if the pressing pressure is too small, the bonding force of the FPC may not be sufficient; if the pressing pressure is too high, the surface of the FPC may be uneven, which will affect the Yield rate of FPC products

Method used

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  • Silicon steel foil for lamination of printed circuit boards and lamination method using the silicon steel foil
  • Silicon steel foil for lamination of printed circuit boards and lamination method using the silicon steel foil
  • Silicon steel foil for lamination of printed circuit boards and lamination method using the silicon steel foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1: Under the pressing condition of 90 tons of pressure, use the silicon steel foil with the thickness of silicon rubber between 0.1-0.8mm and the thickness of the steel plate between 0.05-0.5mm to detect the parallelism of the circuit board correction in the pressing system effect. The test results evaluate the effect of correcting the parallelism of the silicon steel foil of the present invention by FPC flatness, warpage height and service life of the silicon steel foil. Measurements of test results were assessed as described above. The results are shown in Table 1.

[0023] Table 1

[0024]

[0025] FPC flatness: ○ means good flatness, × means poor flatness

[0026] Silicon steel foil warpage: ○ indicates good, × indicates poor

[0027] As shown in Table 1, the thickness of silicon rubber between 0.5-0.8mm and the thickness of steel plate is between 0.2-0.5mm, for example, the silicon steel foil sample A (silicone rubber hardness 50HR) with a thickness ...

Embodiment 2

[0028] Example 2: In the range of silicone rubber hardness from 40 to 70HR, silicon steel foils with different hardness ranges and specific thickness ratios are selected, and under the pressing condition of 90 tons of pressure, the parallelism of the circuit board correction used in the pressing system is tested. effect. The test results evaluate the parallelism correction effect of the silicon steel foil of the present invention based on the flatness of the FPC, the warpage of the silicon steel foil, and the service life. The measurement of the test results was evaluated according to the above method, and the results are shown in Table 2 below.

[0029] Table 2

[0030]

[0031] FPC flatness: ○ means good flatness, × means poor flatness

[0032] Silicon steel foil warpage: ○ indicates good, × indicates poor

[0033] As shown in Table 2, when the hardness range of silicone rubber is 40-55HR (for example, the hardness is 50HR, sample D and sample F), the thickness of sili...

Embodiment 3

[0034] Example 3: In the range of silicone rubber hardness of 50-80HR, silicon steel foils with different hardness ranges and specific thickness ratios were selected, and under a pressure of 90 tons, the effect of providing circuit board parallelism correction in the pressing system was tested. The test results evaluate the effect of correcting the parallelism of the silicon steel foil in the present invention based on the flatness of the FPC, the warpage of the silicon steel foil, and the service life. The measurement of the test results was evaluated as described above, and the results are shown in Table 3.

[0035] table 3

[0036]

[0037] FPC flatness: ○ means good flatness, × means poor flatness

[0038] Silicon steel foil warpage: ○ indicates good, × indicates poor

[0039] As shown in Table 3, when the hardness range of silicone rubber is 55-65HR (for example, the hardness is 60HR, sample H and sample J), ​​the thickness of silicon rubber of silicon steel foil is ...

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Abstract

The invention discloses silicon steel foil used for printed circuit board stitching, and a stitching method using the silicon steel foil. The silicon steel foil comprises a steel plate, and silicone rubber which is glued onto the surface of the steel plate via an adhesive-glue; hardness of the silicone rubber ranges from 40 to 80HR, thickness of the silicone rubber ranges from 0.1 to 0.8mm, and thickness of the steel plate ranges from 0.05 to 0.5mm. The thickness of the silicone rubber and the steel plate is adjusted according to the hardness of the silicone rubber, so that warping degree of the silicon steel foil is reduced, service of the silicon steel foil is prolonged, and flatness of stitched printed circuit boards is improved.

Description

technical field [0001] The invention relates to a silicon steel foil for circuit board lamination and a method for laminating a circuit board using the silicon steel foil, in particular to a silicon steel foil suitable for flexible printed circuit boards and the use of the silicon steel foil for lamination of flexible printed circuit board method. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit, FPC) can be used to carry electronic components, so that the electronic product can play its intended function. Due to the characteristics of flexibility and three-dimensional wiring of flexible printed circuits, under the development trend of scientific and technological electronic products emphasizing lightness, shortness and flexibility, they are currently widely used in computers and their peripheral equipment, communication products and consumer electronics. [0003] In recent years, with the progress of miniaturization, high functionalit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B7/12B32B15/18B32B27/06H05K3/00
Inventor 李建辉林志铭张孟浩金艳陈辉
Owner KUSN APLUS TEC CORP
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