Reverse-side printing process for resistor protruding electrode

Abstract

The invention discloses a reverse-side printing process for a resistor protruding electrode. The process comprises the following steps: (1) printing a reverse-side conductor; (2) printing a resistor layer; (3) printing a resistor protective layer; (4) performing laser cutting; (5) printing a protective layer; (6) printing a conductor; (7) performing terminated sliver treatment; (8) performing electroplating treatment; and (9) testing and packaging. By adoption of the technical scheme, the reverse-side printing process has the beneficial effects that a phenomenon that an original resistor function is ineffective when a user impacts a terminal electrode during use is effectively avoided, the resistor printing side faces downwards in the process of arranging the parts by a client, the current stroke is shortened, the TCR level of the product is improved, and the cost is reduced.

Description

technical field [0001] The invention relates to a resistor printing process, in particular to a reverse printing process of a protruding electrode of a resistor. Background technique [0002] In the prior art, resistors are widely used in electronic circuits. The manufacturing method of a typical chip resistor is as follows: 1. Use screen printing to form the front electrode on the front of a large insulating substrate, and dry it; 2. Use screen printing to form the back electrode on the back of the above insulating substrate, and perform Dry and fire; 3. Use screen printing to form a resistance layer on the inside of the above-mentioned front electrode, dry and fire, and the two ends of the resistance layer are connected to the above-mentioned front electrode; 4. Form the first resistance layer on the above-mentioned resistance layer. A protective layer (i.e. glass protective layer), and drying and firing; 5. For the above-mentioned resistance layer, the resistance is prec...

AI Technical Summary

Problems solved by technology

However, the above-mentioned chip resistor manufacturing method has the following disadvantages: 1. Since the front electrode is made of silver paddle material, and the front electrode is realized by screen printing, the thickness of the film layer is likely to be uneven. After the resistance layer is printed, the initial value of the resistance is easy to disperse. Leading to increased difficulty in production control and increased non-compliance

2. The printed silver paste material is used to form the front electrode of the chip resistor. After firing, the thickness is thicker and the amount used is larger, and the printed material is a sintered paste with silver as the main component. Its price is relatively high, resulting in product The production cost is high and the market competitiveness is weakened

However, the following problems will arise: In the process of testing the product, when the customer loads the resistor into the test equipment, for the convenience of testing, the plug-in method is often used.

Due to the plug-in method, during the plug-in process, the terminal electrode of the resistor is directly in contact with the test equipment, and due to the manual operation test, it is easy to cause damage to the resistor terminal electrode, which will lead to the failure of the original resistor function and the low TCR level of the product.

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