Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacturing method of electronic components

A technology of electronic components and manufacturing methods, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of production efficiency decline, electronic components are not easy to arrange, etc., achieve high reliability, prevent partial damage, The effect of simplifying the process

Active Publication Date: 2018-01-09
MURATA MFG CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the case of only performing the above-mentioned stamping process, the electronic components after the stamping process are not easy to return to the alignment state again, which leads to the problem of decreased production efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of electronic components
  • Manufacturing method of electronic components
  • Manufacturing method of electronic components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0045] figure 1 (a) is a plan view showing the structure of a main assembly (integrated substrate) including a plurality of electronic components (flat cables in Embodiment 1) arranged in an array state, and figure 1 (b) is figure 1 A-A line sectional view of (a), figure 1 (c) is figure 1 (a) B-B line sectional view. figure 2 is the bottom view of the main assembly.

[0046] In this Embodiment 1, the following method will be described: that is, from the arrayed state from the figure 1 (a)~(c) and figure 2 Each flat cable (electronic component) 10 is removed from the main assembly 1 of the shown structure.

[0047] In Embodiment 1, the flat cable 10 removed from the main assembly 1 is used as a high-frequency signal line such as image 3 As shown in (a) and (b), the flat cable 10 has a structure in which a cable main body layer is formed by providing a ground electrode through an insulating base material layer on the upper surface side and the lower surface side of the...

Embodiment approach 2

[0066] Figure 9 It is a bottom view showing the structure of one main surface (lower surface) of a main assembly (integrated substrate) 1 formed in a manufacturing process of an electronic component according to another embodiment (embodiment 2) of the present invention, Figure 10 is expressed in Figure 9 A bottom view of a state in which a support film 20 is pasted on one main surface (lower surface) of the main assembly (integrated substrate) 1, Figure 11 (a) and (b) are figures which show the process of peeling and removing each flat cable 10 from the support film 20. FIG.

[0067] In Embodiment 2, on the portion of the main assembly 1 that is contacted by the tip portion 32a of the pin 32 of the pressing jig 31 , that is, on both end portions and the center portion in the longitudinal direction of each component region 10a, the Protective member 35 (stainless steel plate in Embodiment 2).

[0068] In addition, other configurations are the same as those of the first ...

Embodiment approach 3

[0074] Figure 13 (a) and (b) show steps of peeling and removing each flat cable 10 from the support film 20 of the main assembly 1 (integrated substrate) in still another embodiment (embodiment 3) of the present invention. picture.

[0075] In Embodiment 3, if Figure 13 As shown in (a) and (b), as the pressing jig 31, the pressing jig provided with the surface of the jig main body 31a with the several pin 32 whose front-end|tip part 32a has a pointed shape is used.

[0076] In addition, as the support film 20 , unlike the cases of the first and second embodiments described above, a support film in which no openings are formed is used.

[0077] In addition, on the part of the main assembly 1 that is contacted by the sharp-shaped front end part 32a of the pin 32 of the pressing jig 31, that is, on both ends and the center part in the longitudinal direction of each component area 10a, a There is a protective member 35 (a stainless steel plate in Embodiment 3).

[0078] In a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a method for manufacturing electronic components with high production efficiency, which can remove a plurality of electronic components (each electronic component) after punching from a main assembly in an arrayed state. In the manufacturing method of the electronic component of the present invention, an adhesive supporting film (20) is pasted on one main surface side of the planar main assembly (1), wherein the main assembly (1) is covered with A plurality of electronic components to be removed are integrally arranged in an arrayed state, and then, from the other main surface side of the main assembly (1), cutouts ( 22), in the state where the main assembly (1) is cut but the support film (20) is not cut, a plurality of electronic components (10) are cut off from the main assembly (1), after that, from the main assembly ( 1) A plurality of pins (32) are pressed into one main surface side, and the electronic components (10) are pressed by their front ends, thereby peeling off the plurality of electronic components (10) from the support film (20) , thereby removing a plurality of electronic components (10) while maintaining the aligned state.

Description

technical field [0001] The present invention relates to a method for manufacturing various electronic components such as multilayer substrates, module components, and flat cables, and more particularly to a method for manufacturing electronic components through the following process. Remove each electronic component from the main assembly (assembly) of the component. Background technique [0002] In the manufacture of electronic components, for example, a multi-layer substrate is used as an example. The so-called multi-cavity method is widely used to improve production efficiency. substrate, and then remove multiple sub-substrates (individual multi-layer substrates) from the mother substrate. [0003] Among them, as a method of removing individual electronic components from a motherboard including a plurality of electronic components arranged in a row, there is known a method of cutting the motherboard along a predetermined cutting line to divide it into individual electron...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/40
Inventor 山本重俊
Owner MURATA MFG CO LTD