power conversion device
A technology for power conversion devices and power modules, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as difficulty in achieving light weight and inability to select resins, and achieve the effects of improving cooling efficiency, reducing weight, and suppressing thermal resistance.
Inactive Publication Date: 2016-10-05
FUJI ELECTRIC CO LTD
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Problems solved by technology
Therefore, there is an unsolved problem that since the case is used as a part of the heat transfer path, the case is also required to have good heat transfer, and the material is limited to a metal with a high heat transfer rate, so that the case is required For power conversion devices that are miniaturized and lightweight, lightweight materials such as resins cannot be selected, making it difficult to achieve weight reduction
Method used
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Embodiment Construction
[0060] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0061] figure 1 It is a sectional view showing the overall structure of the power conversion device according to the present invention.
[0062] In the figure, reference numeral 1 is a power conversion device, and the power conversion device 1 is accommodated in a casing 2 . The casing 2 is molded from a synthetic resin material, and is composed of a lower casing 2A and an upper casing 2B that are vertically divided across a cooling body 3 having a water-cooling jacket structure.
[0063] The lower case 2A is constituted by a bottomed square cylinder. The open upper portion of the lower case 2A is covered with a cooling body 3 , and a filter film capacitor 4 is accommodated therein.
[0064] The upper casing 2B includes a square cylinder 2a with open upper and lower ends, and a cover 2b closing the upper end of the square cylinder 2a. Furthermore, the lower end of t...
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Provided is a power converting apparatus which can efficiently dissipate heat of a heat generating circuit component mounted on a substrate to a cooling body without having a housing in a path for dissipating the heat of the heat generating circuit component. This power converting apparatus is provided with: a cooling body (3) having an open window (3g) at a part of a liquid flowing path (3c) in which a cooling liquid flows; and a semiconductor power module (11) wherein, on one surface of a case body (12) having therein a semiconductor switching element for power conversion, a cooling member (13) is formed, said cooling member having a liquid-contacting portion (13a) that is inserted into the open window of the cooling body, and closing the open window of the cooling body. The power converting apparatus is also provided with heat conductive supporting members (32, 33) which support, by keeping predetermined intervals to the semiconductor power module, mounting substrates (22, 23) having circuit components mounted therein, said circuit components including a heat generating circuit component for driving the semiconductor switching element, and which have a liquid-contacting portion (34a) inserted into the open window of the cooling body for the purpose of transferring heat of the mounting substrate to the cooling body.
Description
technical field [0001] The present invention relates to a power conversion device. In the power conversion device, a mounting substrate is supported on a semiconductor power module incorporating a semiconductor switching element for power conversion. The mounting substrate is mounted with a heating circuit including a driving semiconductor switching element. Circuit components of components. Background technique [0002] As such a power conversion device, the power conversion device described in Patent Document 1 is known. In this power conversion device, a water-cooling sheath is arranged in the casing, and a semiconductor power module including an IGBT as a switching element for power conversion is arranged on the water-cooling sheath for cooling. In addition, in the casing, on the side opposite to the water-cooling jacket of the semiconductor power module, a control circuit board is arranged at a predetermined distance, and the heat generated by the control circuit board...
Claims
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IPC IPC(8): H01L23/473H01L25/07H01L25/18
CPCH01L23/473H01L23/4006H01L25/162H01L2924/0002H05K7/20927
Inventor 田中泰仁柴田美里
Owner FUJI ELECTRIC CO LTD