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A kind of packaging method of signal transceiver diode

A technology of signal transceiving and packaging methods, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of complex packaging procedures, low efficiency, and high cost, and achieve the effects of low material cost, improved production efficiency, and reduced production cost

Inactive Publication Date: 2016-06-01
韩刚
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical purpose of the present invention is to provide a packaging method for signal transceiver diodes, which solves the problems of traditional packaging process complexity, high cost and low efficiency

Method used

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  • A kind of packaging method of signal transceiver diode
  • A kind of packaging method of signal transceiver diode
  • A kind of packaging method of signal transceiver diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Embodiment 1: An embodiment of a packaging method for a signal transceiver diode, comprising the following steps:

[0044] ① Bracket: see figure 1 , providing an integrated bracket with multiple diode pin units, the whole bracket can be formed by punching and stamping, the diode pin unit includes positive and negative pins 4, 5, and the upper ends of the positive and negative pins 4, 5 are connected with positive Negative electrode blocks 41, 51; the one-piece bracket has a bottom frame 1 and a cross frame 2, the cross frame 2 makes the diode pin unit not easy to be skewed, bent or even broken, and the positive and negative pole pins 4, 5 are connected with the bottom frame 1 and the cross frame 2 Vertical and horizontal connections, so as to realize the integrated connection of multiple diode pin units.

[0045] ② Die solidification: see Figure 4 , the diode chip is assembled on the diode pin unit of the integrated bracket; an electrode groove 511 is opened on the n...

Embodiment 2

[0051] Embodiment 2: An embodiment of a packaging method of a signal transceiver diode, comprising the following steps:

[0052] ① Bracket: see figure 2 , providing an integrated bracket with multiple diode pin units, the entire bracket can be punched and shaped by a punch; the integrated bracket has a bottom frame 1, and the diode pin unit includes positive and negative pins 4, 5, punched by a punch, etc. The device is punched to suspend the negative pin 5 and the non-suspended positive pin 4, so that the non-suspended positive pin 4 is connected vertically and horizontally with the bottom frame 1, so as to realize the integrated connection of multiple diode pin units; the positive and negative The upper ends of pins 4 and 5 are also connected with positive and negative electrode blocks 41 and 51;

[0053] ② Die solidification: see Figure 4 , the diode chip is assembled on the diode pin unit of the integrated bracket; an electrode groove 511 is opened on the negative elec...

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Abstract

A method for packaging a signal receiving and sending diode comprises the following steps that (1) an integrated support with multiple diode pin units is provided; (2) the die bond is conducted, wherein a diode chip is assembled on each diode pin unit of the integrated support; (3) packaging adhesion is conducted, wherein each diode chip is coated with packaging glue with insulation light permeability so that each diode chip can be sealed and isolated by the packaging glue; (4) solidification is conducted, the packaging glue is solidified; (5) pipe caps are sleeved, wherein the solidified packaging glue is sleeved with the pipe caps; (6) flange sheets are installed, wherein the flange sheets are inserted, from the sides of the diode pin units, in the integrated support, primary fixation is completed, and each flange sheet is fixed to a brim of the bottom of the pipe cap. According to the method for packaging the signal receiving and sending diode, the process is extremely simplified, the pipe caps are effectively fixed through the flange sheets and prevented from falling, the packaging glue is prevented from deviating, the production cost is reduced to a large extent, and the production efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of diode production and processing, in particular to a packaging method for signal transceiver diodes. Background technique [0002] Most of the signal transmitting / receiving diode series products used in electrical sensors, optical communications and other instruments in the remote control emission light source, banknote counters, copiers, and monitors produced in my country currently adopt an integrated base structure. The main disadvantage of the integrated base The reason is that its production process is complex and costly. It needs to go through metal stamping, high-temperature sintering between the glass layer and the lead (the glass layer is formed by melting the glass powder), nickel plating, and gold plating. The forming itself is more troublesome, the yield is low, and the cost is low Difficult to drop; at the same time, since the integrated bases are produced one by one, they are independent of eac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/62
CPCH01L24/97H01L2224/32245H01L2224/32257H01L2224/45144H01L2224/48091H01L2224/73265
Inventor 韩刚
Owner 韩刚