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Method of making system-in-package device, and system-in-package device

A system-in-package and level-package technology, applied in the field of microelectronics, can solve problems such as inability to use

Active Publication Date: 2014-04-30
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the dies are very close in size, conventional methods cannot be used since there is no space for other necessary components such as contact members for providing the necessary input / output functions of the system-in-package device.
Due to this mismatch problem, many functionally advantageous and desirable system-in-package configurations have not become commercially available

Method used

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  • Method of making system-in-package device, and system-in-package device
  • Method of making system-in-package device, and system-in-package device
  • Method of making system-in-package device, and system-in-package device

Examples

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Embodiment Construction

[0039] The following examples are all exemplary. Although the specification may refer to "a", "an" or "some" embodiments, this does not necessarily mean that each such representation is to the same embodiment or that the feature is only applicable to a single implementation. example. Single features of different embodiments may be combined to provide further embodiments.

[0040] In the following, features of the present invention will be described using simple examples of device configurations according to various embodiments of the present invention. Only elements relevant to the description of the embodiment will be described in detail. Various implementations of methods and devices may include elements known to those skilled in the art and may not be specifically described herein.

[0041] figure 2 The basic structure of the system-in-package device manufactured by the method according to the embodiment of the present invention is shown. exist figure 2 In , MEMS di...

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PUM

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Abstract

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

Description

technical field [0001] The present invention relates to the field of microelectronics, and more particularly to a method of manufacturing a system-in-package device (system-in-package) and a system-in-package device comprising at least one first type of die ( die), at least one die of a second type having predetermined dimensions, and at least one other component of the system-level device. Background technique [0002] In different component manufacturing fields, the limited space and increasing circuit integration have put forward requirements on the manufacture of electronic products from many aspects. The size of surface mount components has been decreasing, thereby facilitating the integration of a large number of components onto printed wiring boards. Similar physical size reduction trends are also taking place in the field of microelectromechanical systems (MEMS). Advances in design have led to very high levels of integration and eventually to stacked structures, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/04H01L25/16B81C1/00
CPCH01L25/50H01L24/19H01L24/96H01L25/18B81C1/00333H01L2224/73204H01L25/16B81B7/0032B81C2203/01H01L21/568H01L24/97H01L2224/12105H01L2224/92125H01L2224/97H01L2924/14H01L2924/1433H01L2924/1461H01L2924/15311H01L2924/18162H01L27/14618G01P1/023G01L19/0084H01L23/5389H01L24/16H01L24/17H01L24/32H01L24/73H01L24/92H01L2224/16145H01L2224/1703H01L2224/32145G01L19/148G01P1/026G01P15/0802G01C19/5783H01L2924/181H01L2924/12042H01L2223/6677H01L2224/16227H01L2224/32225H01L23/528H01L2224/81H01L2924/00012H01L2224/83H01L2924/00H01L2224/16225H01L24/83H01L2224/8312H01L2224/8319B81B7/0074B81B2201/0235B81B2201/025B81B2201/0257B81B2201/0264B81B2201/036B81B2207/012B81B2207/095
Inventor 海基·库斯玛
Owner MURATA MFG CO LTD