Fingerprint recognition sensor packaging structure, electronic device and method for manufacturing fingerprint recognition sensor

A fingerprint recognition and packaging structure technology, applied in character and pattern recognition, instruments, computer parts, etc., can solve the problems of large thickness of electronic equipment, easy brittleness of fingerprint imaging sensors, and expensive production of fingerprint recognition sensors.

Active Publication Date: 2014-05-14
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
View PDF3 Cites 53 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional fingerprint recognition sensor forms a matrix fingerprint recognition sensor through the CMOS semiconductor process. Since the fingerprint imaging sensor with the silicon substrate as the substrate is easy to be brittle, a protective lens with high hardness and scratch resistance (such as sapphire) is required. The cost of sapphire is High lead to

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fingerprint recognition sensor packaging structure, electronic device and method for manufacturing fingerprint recognition sensor
  • Fingerprint recognition sensor packaging structure, electronic device and method for manufacturing fingerprint recognition sensor
  • Fingerprint recognition sensor packaging structure, electronic device and method for manufacturing fingerprint recognition sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Please refer to figure 1 , Illustrates the explosive state of a fingerprint recognition sensor packaging structure used in electronic equipment. The electronic device here should be understood in a broad sense, and can be a smart phone, a touchpad, a mobile computing device, an electrical appliance, a panel or body of a vehicle, etc.

[0027] The fingerprint recognition sensor package structure includes a base ring 110 made of metal material, a control button surrounded by the base ring 110, a fingerprint recognition sensor 130 placed under the control button, a flexible element 140 and a reinforcing element 150 placed under the fingerprint recognition sensor 130 , And a spring switch 160 placed under the reinforcing element 150.

[0028] The control button is arranged above and coupled to the circuit of the fingerprint recognition sensor 130. In the electronic device, the control button can be arranged relative to the display element of the electronic device, for example, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a fingerprint recognition sensor packaging structure and an electronic device with the fingerprint recognition sensor packaging structure. The fingerprint recognition sensor packaging structure comprises a control button and a fingerprint recognition sensor arranged below the control button, wherein the control button comprises a glass cover plate and a thin film which coats the surface of the glass cove plate and is made of non-anisotropic dielectric materials. The mode of combining the glass cover plate and the coated film is adopted by the control button, the hardness of the control button is ensured, meanwhile, cost is reduced, in addition, the thickness of the fingerprint recognition sensor packaging structure is not affected, and when the fingerprint recognition sensor packaging structure is embedded into the electronic device, the thickness design of the electronic device is not affected.

Description

Technical field [0001] The invention relates to the field of electronic sensing, in particular to a fingerprint identification sensor packaging structure, electronic equipment using the fingerprint identification packaging structure, and a method for preparing the fingerprint identification sensor. Background technique [0002] The traditional fingerprint recognition sensor uses CMOS semiconductor technology to form a matrix fingerprint recognition sensor. Since the fingerprint imaging sensor with silicon substrate as the substrate is prone to brittleness, it requires a protective lens with higher hardness and scratch resistance (such as sapphire). The cost of sapphire High leads to expensive production of capacitive fingerprint recognition sensors based on monocrystalline silicon. At the same time, the fingerprint identification sensor is prepared to be embedded in the casing of the electronic device in the packaging structure, and the use of sapphire will also result in a large...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06K9/00
Inventor 刘隆主杜东阳白安鵬蔡美雄
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap