Fingerprint recognition sensor packaging structure, electronic device and method for manufacturing fingerprint recognition sensor

Abstract

The invention relates to a fingerprint recognition sensor packaging structure and an electronic device with the fingerprint recognition sensor packaging structure. The fingerprint recognition sensor packaging structure comprises a control button and a fingerprint recognition sensor arranged below the control button, wherein the control button comprises a glass cover plate and a thin film which coats the surface of the glass cove plate and is made of non-anisotropic dielectric materials. The mode of combining the glass cover plate and the coated film is adopted by the control button, the hardness of the control button is ensured, meanwhile, cost is reduced, in addition, the thickness of the fingerprint recognition sensor packaging structure is not affected, and when the fingerprint recognition sensor packaging structure is embedded into the electronic device, the thickness design of the electronic device is not affected.

Description

Technical field [0001] The invention relates to the field of electronic sensing, in particular to a fingerprint identification sensor packaging structure, electronic equipment using the fingerprint identification packaging structure, and a method for preparing the fingerprint identification sensor. Background technique [0002] The traditional fingerprint recognition sensor uses CMOS semiconductor technology to form a matrix fingerprint recognition sensor. Since the fingerprint imaging sensor with silicon substrate as the substrate is prone to brittleness, it requires a protective lens with higher hardness and scratch resistance (such as sapphire). The cost of sapphire High leads to expensive production of capacitive fingerprint recognition sensors based on monocrystalline silicon. At the same time, the fingerprint identification sensor is prepared to be embedded in the casing of the electronic device in the packaging structure, and the use of sapphire will also result in a large...

AI Technical Summary

Problems solved by technology

[0002] The traditional fingerprint recognition sensor forms a matrix fingerprint recognition sensor through the CMOS semiconductor process. Since the fingerprint imaging sensor with the silicon substrate as the substrate is easy to be brittle, a protective lens with high hardness and scratch resistance (such as sapphire) is required. The cost of sapphire is High lead to expensive production of capacitive fingerprint recognition sensors based on monocrystalline silicon

At the same time, the fingerprint recognition sensor is prepared to be embedded in the shell of the electronic device in a packaging structure, and the use of sapphire will also lead to a larger thickness of the fingerprint recognition sensor package and the electronic device

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