Short and low loop wire bonding
A bonding and wire technology, applied in the field of semiconductor packaging, can solve the problems of reducing the loop height, increasing the lateral dimension and size of the package, and achieving the effect of reducing stress
Active Publication Date: 2014-05-14
CARSEM M
View PDF4 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, this increases the lateral dimension of the package and the size
Other methods that have been used to reduce loop height when connecting contacts at different levels do not provide the same benefits as methods used in combination with contacts at the same height or level
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0021] Embodiments of the present invention provide wire bonding between contacts at substantially the same height or level in a semiconductor package. One or both contacts may be bond pads on a semiconductor die, bond pads on a substrate, leads of a lead frame, or the like. For example, in one embodiment, a bonding wire connects a bond pad on a first semiconductor die with a bond pad on a second semiconductor die. The bonding wire may include a bump on each side of a kink, where the kink is lower than the bump but higher than the surface being bonded. The bonding wires can provide lower loop heights, shorter wire lengths, and reduced stress compared to conventional methods.
[0022] figure 1 is a simplified diagram of a bonding wire used to electrically connect two surfaces at the same level or level according to one embodiment of the invention. figure 1 The layout shown may exist in an assembled semiconductor package which may also contain an encapsulant material (not sho...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention relates to short and low loop wire bonding. A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads (106a / b, 206a / b, 406a / b, 506a / b, 706a / b) disposed thereon. The upper surface of the second semiconductor die may be substantially coextensive with the upper surface of the first semiconductor die and extend substantially along a plane. The multi-die package also includes a plurality of bonding wires (102, 202, 402) each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires has a kink (114, 414, 418, 514, 518) disposed at a height above the plane, a first hump (112, 116, 412, 416, 512, 516) disposed between the first semiconductor die and the kink, and a second hump disposed between the second semiconductor die and the kink.
Description
[0001] This divisional application is based on the divisional application of the Chinese patent application with the application number 201210028228.2, the application date is February 9, 2012, and the invention title is "short and low loop wire bonding". technical field [0002] The present invention relates generally to semiconductor packages, and more particularly to wire bonding between contacts on substantially the same height or level in a semiconductor package. Background technique [0003] One aspect of semiconductor packaging involves wire bonding processes. A conventional wire bonding process may use conductive wires to connect a semiconductor die to the leads of a leadframe. This allows the semiconductor die to communicate electrically with external systems. Wire bonding processes typically create loops in the conductive wires. The height of the loop determines the allowable thickness of the semiconductor package. [0004] Semiconductor packages are continually...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L23/4952H01L24/45H01L24/48H01L24/78H01L24/85H01L2224/45015H01L2224/45144H01L2224/45147H01L2224/48095H01L2224/48137H01L2224/48465H01L2224/48471H01L2224/48479H01L2224/4848H01L2224/78301H01L2224/85045H01L2224/85051H01L2224/8518H01L2224/85181H01L2224/85186H01L2224/85205H01L2224/85986H01L2924/00011H01L2924/00014H01L2924/01019H01L2924/01029H01L2924/01033H01L2924/01082H01L2924/20752H01L2924/00H01L2924/01006H01L2224/4554H01L2224/85399H01L2224/05599H01L2924/00012H01L2224/43848H01L2924/01005H01L2924/01079
Inventor 刘兆合刘卉林
Owner CARSEM M