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Printed wiring board and method for manufacturing printed wiring board

A technology of a printed wiring board and a manufacturing method, which is applied to the manufacturing field of printed wiring boards and printed wiring boards, can solve the problems of complicated manufacturing process of printed wiring boards, difficulty in improving yield, and increase in manufacturing cost, and achieves the freedom of wiring design. The effect of improving, improving yield, and reducing manufacturing cost

Active Publication Date: 2014-05-14
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the manufacturing process of the conventional metal core type printed wiring board is complicated, the manufacturing cost increases, and it is difficult to improve the yield
In addition, there is a constraint that only the metal plate of the core can be used as a flat conductor

Method used

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  • Printed wiring board and method for manufacturing printed wiring board
  • Printed wiring board and method for manufacturing printed wiring board
  • Printed wiring board and method for manufacturing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0045] Picture 10 (B) shows the printed wiring board of the first embodiment. The printed wiring board 10 includes a core substrate 30 having an upper insulating layer 20F and a lower insulating layer 20S.

[0046] Image 6 (C) shows the core substrate 30. An upper conductive layer 38F is formed on the upper insulating layer 20F, and a lower conductive layer 38S is formed under the lower insulating layer 20S. A core conductor layer 38C is formed between the upper insulating layer and the lower insulating layer. In the opening 31F of the upper insulating layer 20F, an upper via conductor 36F connecting the upper conductor layer 38F and the core conductor layer 38C is formed.

[0047] In the opening 31S of the lower insulating layer 20S, a lower via-hole conductor 36S connecting the lower conductor layer 38S and the core conductor layer 38C is formed. The lower conductor layer 38S is formed by patterning the lower metal foil 22S laminated on the lower insulating layer 20S. The c...

no. 2 Embodiment approach

[0080] Picture 11 , Picture 12 The manufacturing method of the printed wiring board of the 2nd Embodiment of this invention is shown. In the manufacturing method of the second embodiment, to the reference Figure 1 ~ Figure 4 The steps of (B) are the same as in the first embodiment. However, the lower metal foil 22S is, for example, copper foil and has a thickness of 16 μm. The upper metal foil 22F is, for example, copper foil like the lower metal foil, and has a thickness of 12 μm.

[0081] After the opening 31F is formed in the upper insulating layer 20F ( Picture 11 (A)), along Picture 11 The X2-X2 line in (A) cuts the intermediate body with the support plate. The cut portion is located inside the fixed portion 14. Separate the intermediate 30α from the support plate 10 ( Picture 11 (B), Picture 12 (A)).

[0082] An electroless plating film 42 is formed on the upper metal foil 22F, the inner wall of the upper opening 31F, and the lower metal layer 22S. The electroless ...

no. 3 Embodiment approach

[0087] Figure 13 A cross-sectional view of the printed wiring board of the third embodiment is shown.

[0088] In the third embodiment, a via hole conductor 136 penetrating the printed wiring board is formed, and an L-shaped heat sink 140 is mounted on the via hole conductor, and the heat sink 140 is in contact with the upper portion of the semiconductor element (not shown). In the third embodiment, the heat sink 140 and the via-hole conductor 136 can be used to efficiently dissipate the heat generated in the semiconductor element to the lower side of the printed wiring board.

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Abstract

The invention provides a printed wiring board and a method for manufacturing the printed wiring board. A process for manufactuign the printed wiring board is simple and a plurality of electrically independent via lands can be arranged in a core metal layer. Since a metal core structure having the core conductive layer (38C) in the center of the core substrate (30) is employed, warping is suppressed due to the rigidity of the thick core conductive layer (38C), and the demand for thinner boards can be met. A plurality of electrically independent via lands can be arranged in the core conductive layer (38C), so that flexibility in wiring design is enhanced, and a highly integrated wiring board is also achieved.

Description

Technical field [0001] The present invention relates to a method for manufacturing a multilayer build-up type printed wiring board that is sequentially stacked using a support plate, and the printed wiring board. Background technique [0002] In order to cope with the thinning of electronic devices, it is required to reduce the thickness of the built-in printed wiring board. When the thickness of the printed wiring board is reduced, the rigidity of the insulating layer is reduced, and warpage or the like is likely to occur. In order to cope with this situation, in the build-up multilayer printed wiring board in which build-up layers are provided in the core substrate, various structures in which a rigid metal plate is incorporated in the core substrate have been proposed. [0003] Patent Document 1 discloses a metal core type printed wiring board in which a metal plate is accommodated in a core substrate. In this printed wiring board, an opening for the passage of through-hole co...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0206H05K1/0271H05K3/0097H05K3/108H05K3/4608H05K3/4652H05K2201/066H05K2201/10287H05K2201/1056H05K2203/0369H05K2203/072H05K2203/0723H05K2203/1536
Inventor 渡边哲
Owner IBIDEN CO LTD