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Cooling device of handheld electronic device

A technology for electronic devices and heat sinks, applied in electrical components, heat exchange equipment, indirect heat exchangers, etc., can solve problems such as slow heat dissipation efficiency of heat sinks

Inactive Publication Date: 2014-05-14
DONG GUAN HAN XU HARDWARE & PLASTIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a heat dissipation device for handheld electronic devices, which can effectively solve the problem of slow cooling efficiency of heat dissipation devices for existing handheld electronic devices

Method used

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  • Cooling device of handheld electronic device
  • Cooling device of handheld electronic device
  • Cooling device of handheld electronic device

Examples

Experimental program
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Effect test

Embodiment Construction

[0038] Please refer to as Figure 1 to Figure 5 As shown, it is the first embodiment of the heat dissipation device of the handheld electronic device according to the present invention, which mainly includes a combination of a thin metal plate 1 and more than one heat pipe 2, and wherein:

[0039] sheet metal 1 such as figure 1 , which is to select a metal plate with better heat conduction effect, and stamp and form the thin metal plate 1 integrally to have a plurality of buckle clips 11 distributed at intervals, and each buckle clip 11 is matched with the position of the heat pipe 2; The heat pipe 2 is in a flat and thin shape, and is matched with and embedded in each buckle clip 11 (such as figure 2 ).

[0040] With the above-mentioned thin metal plate 1 and heat pipe 2, after the heat pipe 2 is embedded in each buckle clip 11, pressurize and deform one side or both sides of the buckle clip 11 (such as image 3 The direction of force shown by the arrow), so that one side...

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Abstract

The invention discloses a cooling device of a handheld electronic device. The cooling device is composed of sheet metal and one or more heat pipes in a combined mode, the sheet metal is integrally formed in a pressed mode and provided with a plurality of buckling and clamping pieces distributed at intervals, the positions of the buckling and clamping pieces correspond to those of the heat pipes in a matched mode so that the heat pipes can be embedded into the buckling and clamping pieces, then one side or two sides of each buckling and clamping piece are pressed to deform, so that one side or two sides of each buckling and clamping piece tightly wrap the corresponding heat pipe in a combined mode after being folded and deforming, heat can be rapidly transmitted to the sheet metal due to the fact that the heat pipes make contact with heating assemblies in an attached mode, and the cooling task is rapidly completed. Therefore, the heat can be effectively prevented from accumulating, cooling efficiency is improved, and the situation that the handheld electronic device shuts down or the assemblies are damaged is avoided.

Description

technical field [0001] The invention relates to a heat dissipation device, especially a heat dissipation device of a hand-held electronic device, which is composed of a thin metal plate and more than one heat pipe. Background technique [0002] Various known handheld electronic devices, such as mobile phones, laptops, tablet computers, iPads, PDAs, GPS and other portable handheld electronic devices, are advancing rapidly due to the rapid development of technology, so their volume and appearance have become flatter Thin and light, but the computing function is becoming more and more powerful, so that the internal central processing unit (CPU) and integrated circuit (IC) and other components will generate considerable heat during operation, so it is necessary to try to eliminate the high heat before it can be used. Ensure the normal operation of the heating element and maintain its service life. [0003] Conventional heat sinks for handheld electronic devices are limited by t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCF28D15/0233F28D15/0275F28F2275/08H05K7/20336H05K7/20445H05K7/20254
Inventor 黄崇贤
Owner DONG GUAN HAN XU HARDWARE & PLASTIC TECH CO LTD
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