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A kind of synthetic method of adhesive for high refractive index LED encapsulation glue

A technology of LED encapsulation and high refractive index, which is applied in the direction of adhesives, electrical components, circuits, etc., can solve the problems of no adhesion between potting adhesive and base material, poor adhesion between potting adhesive and encapsulation base material, and achieve Easy industrial production, low price, good adhesion and adhesion effect

Inactive Publication Date: 2015-11-18
YANTAI DEBANG ADVANCED SILICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In recent years, LED packaging has developed rapidly, but there are still some problems. The adhesion between the potting compound and the substrate for packaging is poor. After the potting compound is cured, there is no adhesion between the potting compound and the substrate.

Method used

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  • A kind of synthetic method of adhesive for high refractive index LED encapsulation glue
  • A kind of synthetic method of adhesive for high refractive index LED encapsulation glue
  • A kind of synthetic method of adhesive for high refractive index LED encapsulation glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022]

[0023] In the formula, n 1 = 4 ~ 6, n 2 = 6 ~ 8, n 3 =2~4.

[0024] 1) Synthesis of hydroxy-terminated methylphenyl vinyl silicone oil

[0025] The oil bath was heated up to 60°C, and 16 grams of octamethylcyclotetrasiloxane, 16 grams of octaphenylcyclotetrasiloxane, 8 grams of tetramethyltetravinylcyclotetrasiloxane, 5 1 gram of acetic anhydride and 1 gram of concentrated sulfuric acid, and started stirring, and after stirring for 4 hours, stop the reaction. Add n-heptane, quickly wash with water, let stand to separate the liquid, until the washing solution is neutral, take the upper oil phase, add anhydrous sodium sulfate, let stand for 3 hours, and filter. Re-distillation and vacuum distillation until no distillate appears, stop the distillation. Obtain 31 grams of hydroxyl-terminated methyl vinyl phenyl silicone oil, which is sealed and stored for use in the synthesis of adhesives.

[0026] 2) Synthetic adhesive

[0027] Take by weighing 17 grams of γ-gl...

Embodiment 2

[0029]

[0030] In the formula, n 1 = 4 ~ 6, n 2 = 6 ~ 8, n 3 =2~4.

[0031] 1) Synthesis of hydroxy-terminated methylphenyl vinyl silicone oil

[0032] The oil bath was heated up to 60°C, and 18 grams of octamethylcyclotetrasiloxane, 16 grams of octaphenylcyclotetrasiloxane, 10 grams of tetramethyltetravinylcyclotetrasiloxane, 6 1 gram of acetic anhydride and 1.2 gram of concentrated sulfuric acid, and start stirring, and after stirring for 4 hours, stop the reaction. Add n-heptane, quickly wash with water, let stand to separate the liquid, until the washing solution is neutral, take the upper oil phase, add anhydrous sodium sulfate, let stand for 3 hours, and filter. Re-distillation and vacuum distillation until no distillate appears, stop the distillation. Obtain 33 grams of hydroxyl-terminated methyl vinyl phenyl silicone oil, which is sealed and stored for use in the synthesis of adhesives.

[0033] 2) Synthetic adhesive

[0034] Take by weighing 20 grams of γ-g...

Embodiment 3

[0036]

[0037] In the formula, n 1 = 4 ~ 6, n 2 = 6 ~ 8, n 3 =2~4.

[0038] 1) Synthesis of hydroxy-terminated methylphenyl vinyl silicone oil

[0039] The oil bath was heated up to 65°C, and 34 grams of octamethylcyclotetrasiloxane, 34 grams of octaphenylcyclotetrasiloxane, 16 grams of tetramethyltetravinylcyclotetrasiloxane, 15 1 gram of acetic anhydride and 3 gram of concentrated sulfuric acid, and start stirring, and after stirring for 4 hours, stop the reaction. Add n-heptane, quickly wash with water, let stand to separate the liquid, until the washing solution is neutral, take the upper oil phase, add anhydrous sodium sulfate, let stand for 3 hours, and filter. Re-distillation and vacuum distillation until no distillate appears, stop the distillation. Obtain 78 grams of hydroxyl-terminated methyl vinyl phenyl silicone oil, which is sealed and sealed for use in the synthesis of adhesives.

[0040] 2) Synthetic adhesive

[0041] Weigh 41 grams of γ-glycidyl ethe...

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Abstract

The invention relates to an adhesive for high-refractive index LED (Light Emitting Diode) package glue and an adhesive synthesizing method. The structural formula of the adhesive is shown in descriptions (img file='DDA00002410899400011. TIF' wi='1538' he=422' / ). In the structural formula, n1 is 4-6, n2 is 6-8 and n3 is 2-4. The adhesive synthesizing method comprises the following steps: firstly synthesizing hydroxyl-terminated methyl vinyl silicon oil, and then carrying out methanol removal reaction by using the synthesized hydroxyl-terminated methyl vinyl silicon oil as a reactant, thus obtaining the adhesive. The adhesive contains expoxy groups, silicon methyl groups and vinyl groups and has very good adhesion and adhesive force; phenyl groups contained in the adhesive can enable the adhesive to be applied to the high refractive index package resin relatively well; the adhesive synthesizing method is simple and practicable; the used raw materials are low in cost; the synthesized adhesive has strong adhesion and adhesive force; and industrial production of the synthesized adhesive is facilitated.

Description

technical field [0001] The invention relates to a method for synthesizing an adhesive for high-refractive index LED encapsulation adhesive, in particular to an adhesive used in LED potting adhesive and a synthesis method thereof. Background technique [0002] Nowadays, LEDs are widely used in a wide range of applications. Electronic products, household appliances, traffic signs, billboards and other occasions that require electric light sources or surface light sources are all LED application markets. As the fourth-generation light source, high-power LED is known as "green light source". It has the advantages of small size, low voltage, safety, long life, high electro-optical conversion efficiency, energy saving and environmental protection, etc. It will surely become a new generation of light source in the 21st century. [0003] Due to the complex structure and process of LED packaging, which directly affects the performance and life of LEDs, the packaging materials used in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/06C09J183/07C08G77/20H01L33/56
Inventor 陈维吴军王建斌陈田安
Owner YANTAI DEBANG ADVANCED SILICON MATERIALS