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Inductance element and its manufacturing method

A technology of inductance components and manufacturing methods, which is applied in the direction of electrical components, inductance/transformer/magnet manufacturing, transformer/inductor parts, etc., can solve the problems of delamination of iron powder core, change of magnetic couple set distance, displacement of inductance value, etc.

Inactive Publication Date: 2016-09-28
SHANGHAI ZHUO KAI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the manufacturing process of the prior art, after putting the iron powder core into the annular groove on the insulating base material, there will be a gap between the iron powder core and the annular groove, but the gas existing in the gap will cause the iron powder to expand after being heated. Powder core delamination phenomenon
and figure 1 It is a schematic diagram of another inductance element produced according to the traditional process method, mainly filling the gap between the iron powder core and the annular groove with a filling substance (such as a gelatinous substance), but this manufacturing method may or may not be After the completion, other raw material layers and filling materials are easy to press on the iron powder core, which will easily cause the change of the magnetic couple distance, resulting in the displacement of the inductance value.

Method used

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  • Inductance element and its manufacturing method
  • Inductance element and its manufacturing method
  • Inductance element and its manufacturing method

Examples

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Embodiment Construction

[0023] Figure 2A to Figure 2B It is a flow diagram of an inductance element and its manufacturing method drawn according to an embodiment of the present invention. A is a top view, and B is a schematic cross-sectional view after cutting along a and a' in the top view A.

[0024] Please refer to FIG. 2, the base is a flat insulating substrate 10, and the bottom is a lower conductive material layer 12. For the convenience of distinguishing directions, the side of the lower conductive material layer in FIG. 2 is defined as the bottom surface 112; Surface 111. In one embodiment of the present invention, an epoxy resin glass fiber board (FR4) is used as the substrate, and copper foil is used as the lower conductive material layer 12 below. Figure 2A The figure in is the position and the completed shape for the follow-up predetermined steps, where the dotted line part is a schematic diagram of the completion of the bottom surface 112, the part filled with solid lines is a schema...

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PUM

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Abstract

The invention relates to an inductance component. The inductance component comprises an insulating base material, a ring-shaped magnetic material, an insulating material layer, a winding structure and a solder mask; the insulating base material is provided with a ring-shaped groove; the ring-shaped magnetic material is arranged in the ring-shaped groove; a gap is formed between the ring-shaped magnetic material and the ring-shaped groove; the insulating material layer is arranged above the insulating base material and is provided with a first through hole; the first through hole is communicated to the gap; the winding structure is arranged on the periphery of the ring-shaped groove; the solder mask is arranged above the winding structure and the insulating material layer and is provided with a second through hole, wherein the second through hole is communicated to the first through hole, forms a vent hole with the first through hole, and is used for communicating the outside air and the gap.

Description

technical field [0001] The invention relates to an inductance element and a manufacturing method thereof, in particular to an air vent on the inductance element and a manufacturing method thereof. Background technique [0002] With the advancement of technology and the market's demand for light, thin, short, and small components, inductive components have been widely used in various electronic devices, such as chip-type inductive components, which not only occupy a small volume on the circuit board, The installation is more in line with the needs of surface mount technology, which is convenient for automatic assembly settings. [0003] In the manufacturing process of the prior art, after putting the iron powder core into the annular groove on the insulating base material, there will be a gap between the iron powder core and the annular groove, but the gas existing in the gap will cause the iron powder to expand after being heated. Powder core delamination phenomenon. and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/00H01F41/00
Inventor 温耀隆
Owner SHANGHAI ZHUO KAI ELECTRONICS TECH
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