Embedded cavity multilayer printed board structure

A multi-layer printed board, printed board technology, applied in the direction of printed circuit components, etc., can solve the problem that the sound quality of hand-held electronic products fails to meet the expectations of consumers, achieve the extension of the propagation path, improve the overall performance, The effect of improving sound quality

Active Publication Date: 2016-12-28
JIANGSU PROVISION ELECTRONICS CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the market competition of consumer electronic products is becoming more and more fierce, and the public has higher and higher requirements for consumer electronic products. Although the number of electronic devices integrating voice, music and video is increasing, the sound of these handheld electronic products Quality fails to meet consumer expectations

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Embedded cavity multilayer printed board structure
  • Embedded cavity multilayer printed board structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] In conjunction with the accompanying drawings, the present invention is described in detail, but the scope of protection of the present invention is not limited to the following examples, that is, all simple equivalent changes and modifications made with the patent scope of the present invention and the content of the specification are still patents of the present invention. covered.

[0018] Such as figure 1 , 2 As shown, a multilayer printed board structure with a built-in cavity includes several layers of circuit layers 1 and an insulating layer 2 located between every two adjacent circuit layers, and the insulating layer located in the inner layer of the multilayer printed board At least one embedded cavity 3 for sound transmission is provided on at least one of the circuit layer, and the multilayer printed board is located on the same side of the embedded cavity for sound transmission and the insulating layer respectively penetrates the Two acoustic holes 4 are p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an internally-embedded cavity-based multi-layer printed board structure comprising a plurality of line layers and an insulation layer arranged between each two adjacent line layers. According to the multi-layer printed board, at least one internally-embedded cavity for sound transferring is arranged at at least one of the insulation layer and the line layer at the inner layer; two sound holes respectively penetrating the line layer and the insulation layer at the same side of the internally-embedded cavity for sound transferring are arranged at the line layer and the insulation of the multi-layer printed board at an interval and are communicated with the internally-embedded cavity for sound transferring. According to the internally-embedded cavity-based multi-layer printed board structure, the product packaging size is reduced and the product tone quality is improved.

Description

technical field [0001] The invention relates to a printed board, in particular to a multilayer printed board structure with a built-in cavity, which is mainly used for the structure of an acoustic PCB board. Background technique [0002] At present, the market competition of consumer electronics products is becoming more and more fierce, and the public has higher and higher requirements for consumer electronics products. Although the number of electronic devices integrating voice, music and video is increasing, the sound of these handheld electronic products The quality failed to meet consumer expectations. Contents of the invention [0003] In order to overcome the above-mentioned defects, the present invention provides a multi-layer printed board structure with a built-in cavity, which can not only reduce the packaging volume of the product, but also improve the sound quality of the product. [0004] The technical solution adopted by the present invention in order to so...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
Inventor 马洪伟马永新
Owner JIANGSU PROVISION ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap