A kind of LED packaging body and lighting device

Abstract

The invention provides an LED packaging body suitable for the LED product field. The LED packaging body comprises a flip-chip wafer, fluorescent adhesives and transparent packaging adhesives, wherein the flip-chip wafer is coated with the fluorescent adhesives and the fluorescent adhesives are coated with the transparent packaging adhesives. A positive electrode and a negative electrode are arranged at the bottom of the flip-chip wafer, the periphery of the fluorescent adhesives extends outwards to form a brim-shaped outer edge, and the periphery of the transparent packaging adhesives extends to be arranged on the outer edge. The whole LED packaging body is only composed of the flip-chip wafer, the fluorescent adhesives, the transparent packaging adhesives and the expansion electrodes, reliability is high, materials are saved, cost is low and the productivity is high; because the packaging body is not limited by supports, large-scale integrated packaging is facilitated; bowl or cup glue ejection is not adopted, loss caused by scattering-in of photons in fluorescent powder can be reduced, and therefore product brightness can be conveniently improved; because it is not needed that the positive electrode and negative electrode of the wafer are coated with Au-Sn alloy layers, cost is reduced.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an LED packaging body and a lighting device. Background technique [0002] The packaging method of traditional white LED products is to fix the LED chip in the cup on the bracket by bonding or eutectic welding, and use gold wires to connect the positive pole of the chip to the positive pole of the bracket, and connect the negative pole of the chip to the On the negative pole of the bracket, fill the bowl with fluorescent glue that matches the target color area. Due to the different thermal expansion coefficients of brackets, fluorescent glue, and colloids used to bond chips, LED packages are prone to reliability problems in terms of brackets, fluorescent glue, gold wires, and colloids; and there are many types of LED brackets, bonding chips and brackets The materials of the positive and negative electrodes are mostly PPA, PCT and EMC materials, which have relatively large d...

AI Technical Summary

Problems solved by technology

Due to the different thermal expansion coefficients of brackets, fluorescent glue, and colloids used to bond chips, LED packages are prone to reliability problems in terms of brackets, fluorescent glue, gold wires, and colloids; and there are many types of LED brackets, bonding chips and brackets The materials of the positive and negative electrodes are mostly PPA, PCT and EMC materials, which have large defects in high temperature resistance and air tightness, which will affect the reliability of LED products.

Although the ceramic bracket has good high temperature resistance and good air tightness, the cost of the bracket is close to the cost of the chip, and the manufacturing cost of the ceramic bracket package LED is expensive, and the investment in equipment is large, resulting in the small production capacity and high price of the LED product of the ceramic bracket.

Therefore, the defects of LED products with bracket package structure in terms of reliability, service life, manufacturing cost and price are the biggest obstacles for LED products to replace traditional lighting products.

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