A kind of LED encapsulation structure and lighting equipment

Abstract

The invention provides an LED packaging structure suitable for the field of LED products. The LED packaging structure comprises a flip-chip wafer, fluorescent adhesives and transparent packaging adhesives, wherein the flip-chip wafer is coated with the fluorescent adhesives coated with the transparent packaging adhesives. A positive electrode and a negative electrode are arranged at the bottom of the flip-chip wafer, and the surface of the positive electrode and the surface of the negative electrode are respectively provided with a nickel layer, a gold layer and a tin layer. The periphery of the fluorescent adhesives extends outwards to form a brim-shaped outer edge, and the periphery of the transparent packaging adhesives extends to be arranged on the outer edge. The LED packaging structure is only composed of the wafer, the fluorescent adhesives, the transparent packaging adhesives, the nickel layers, the gold layers and the tin layers and is high in reliability and low in cost, and materials are saved; large-scale integrated packaging is facilitated, and product brightness can be conveniently improved; because Au-Sn alloy does not need to be applied to the bottom of the wafer, cost is reduced; because the tinned bottom is well welded to an application end, welding reliability and operability are improved; application limitations are removed; the tinned layers can also serve as buffering layers for thermal expansion matching between the wafer and an application-end substrate, and therefore the wafer is effectively protected.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an LED packaging structure and lighting equipment. Background technique [0002] The packaging method of traditional white LED products is to fix the LED chip in the cup on the bracket by bonding or eutectic welding, and use gold wires to connect the positive pole of the chip to the positive pole of the bracket, and connect the negative pole of the chip to the On the negative pole of the bracket, fill the bowl with fluorescent glue that matches the target color area. Due to the different thermal expansion coefficients of brackets, fluorescent glue, and colloids used to bond chips, LED packages are prone to reliability problems in terms of brackets, fluorescent glue, gold wires, and colloids; and there are many types of LED brackets, bonding chips and brackets The materials of the positive and negative electrodes are mostly PPA, PCT and EMC materials, which have relatively l...

AI Technical Summary

Problems solved by technology

Due to the different thermal expansion coefficients of brackets, fluorescent glue, and colloids used to bond chips, LED packages are prone to reliability problems in terms of brackets, fluorescent glue, gold wires, and colloids; and there are many types of LED brackets, bonding chips and brackets The materials of the positive and negative electrodes are mostly PPA, PCT and EMC materials, which have large defects in high temperature resistance and air tightness, which will affect the reliability of LED products.

Although the ceramic bracket has good high temperature resistance and good air tightness, the cost of the bracket is close to the cost of the chip, and the manufacturing cost of the ceramic bracket package LED is expensive, and the investment in equipment is large, resulting in the small production capacity and high price of the LED product of the ceramic bracket.

Therefore, the defects of LED products with bracket package structure in terms of reliability, service life, manufacturing cost and price are the biggest obstacles for LED products to replace traditional lighting products.

[0003] Moreover, LED products packaged in traditional brackets need to set a gold-tin alloy layer on the bottom of the chip to solder the chip to the bracket. The gold-tin alloy material is expensive, the preparation cost is extremely high, and it affects the light extraction efficiency. The tin alloy layer is very thin, which has caused great limitations to the application side of the bracketless package.

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