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Composite flexible printed circuit board structure

A flexible printed circuit and flexible circuit board technology, applied in the structural connection of printed circuits, printed circuit components, etc., can solve problems such as poor heat resistance and dimensional stability, and achieve high-density thinning, The effect of high reliability and high dimensional stability

Active Publication Date: 2017-05-03
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the prior art, the heat resistance and dimensional stability of the hard part in the rigid-flex board structure are not good

Method used

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  • Composite flexible printed circuit board structure
  • Composite flexible printed circuit board structure
  • Composite flexible printed circuit board structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1: as figure 1 Shown is the composite flexible printed circuit board structure 100 of this embodiment, including: a flexible printed circuit board 120, including: a body layer 121 having an opposite first surface 121a and a second surface 121b, and the first surface 121a and the second surface 121b have a first circuit layer 122 and a second circuit layer 122'; including: a first cover film formed on the top surface 120a of the flexible circuit board 120 and covering the first circuit layer 122 123; further comprising: a second cover film 123' formed on the bottom surface 120b of the flexible circuit board 120 to cover the second circuit layer 122', wherein the first cover film 123 and the second cover film 123 'The surface has a first bonding area 1A1 and a second bonding area 1A2 that are smaller than the flexible circuit board 120 and are opposite to each other, for setting the first bonding plate 110 and the second bonding plate 110', wherein the first bo...

Embodiment 2

[0029] Embodiment 2: as figure 2 Shown is the composite flexible printed circuit board structure 200 of this embodiment, including: a flexible printed circuit board 220, which includes: a body layer 221 having opposite first surfaces 221a and second surfaces 221b, and the first The surface 221a and the second surface 221b have a first circuit layer 222 and a second circuit layer 222', wherein a first adhesive layer 224 is provided between the body layer 221 and the first circuit layer 222, and a first adhesive layer 224 is formed between the body layer 221 and the second circuit layer. There is a second adhesive layer 224' between the wiring layers 222'; including: a first cover film 223 formed on the top surface 220a of the flexible printed circuit board 20 and covering the first wiring layer 222; including: formed on On the bottom surface 220b of the flexible printed circuit board 220, there is a second cover film 223' covering the second circuit layer 222', wherein the sur...

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Abstract

The invention discloses a combined type flexible printed circuit board structure which comprises a flexible printed circuit board, a first combination board and a second combination board. The flexible printed circuit board comprises a top surface and a bottom surface, wherein the top surface and the bottom surface are opposite to each other; the top surface is provided with a first circuit layer; the bottom surface is provided with a second circuit layer; a first cover film is formed in the top surface, and the first circuit layer is covered with the first cover film; a second first cover film is formed in the bottom surface, and the second circuit layer is covered with the second first cover film; the surface of the first cover film and the surface of the second cover film are provided with a first combination area and a second combination area respectively, wherein the area of the first combination area and the area of the second combination area are smaller than that of the flexible printed circuit board, and the first combination area and the second combination area are opposite to each other; the first combination board and the second combination board area are respectively composed of a bonding layer, a polyimide layer and a copper layer and are formed in the first combination area and the second combination through the bonding layers respectively. Since the combined type flexible printed circuit board structure is formed by laminating the non-adhesive double-layer boards and the flexible board through the bonding layers, the combined type flexible printed circuit board structure not only has the reliability of the non-adhesive double-layer boards and the flexibility of the flexible board but also has the advantages of high size stability, heat resistance, high reliability, high-density thinning and the like.

Description

technical field [0001] The invention relates to a composite flexible printed circuit board, in particular to a composite flexible printed circuit board structure composed of a plurality of non-adhesive soft boards. Background technique [0002] Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing day by day. Due to the characteristics of flexibility and three-dimensional wiring, flexible printed circuit boards are currently widely used in computers and their peripheral equipment, Communication products and consumer electronics products, etc. The types of flexible printed circuit boards mainly include the following types, single-sided boards, double-sided boards, multi-layer boards and rigid-flex boards. Boards are the most widely used. [0003] However, in the prior art, the heat resistance and dimensional stability of the hard part in the rig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14
Inventor 吕常兴林志铭李建辉金进兴
Owner KUSN APLUS TEC CORP