A method for preparing a lead frame for chip packaging
A lead frame and chip packaging technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low precision, damage to BGA products, and failure to meet the packaging requirements of BGA products, so as to avoid damage, The effect of improving manufacturing precision and improving product quality
Active Publication Date: 2017-01-18
AKM ELECTRONICS INDAL PANYU
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Problems solved by technology
[0004] The above method can no longer meet the packaging requirements of BGA products, because the above process is not only low in precision, but also may damage BGA products after secondary etching after packaging
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Embodiment 1
[0034] This embodiment discloses a method for preparing a lead frame for chip packaging, comprising the following steps:
[0035] (1), such as Figure 2a As shown, a layer of dry film (202, 203) is attached to the upper and lower surfaces of a whole piece of metal copper foil substrate 201, the upper layer of dry film 202 is used as a patterning medium for metal patterning, and the lower layer of dry film 203 is used to protect the copper foil Not etched by etching potion during processing;
[0036] (2), such as Figure 2b As shown, part of the dry film on the upper surface of the metal copper foil substrate is removed by exposure and development to expose the metal copper foil part that needs to be etched and removed in the lead frame; that is, this step is only one-side exposure and development, only exposure and Develop the upper layer dry film 202, the lower layer dry film 203 as a protective function does not need to be exposed and developed, so that it can continue to ...
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Abstract
The invention belongs to the technical field of lead wire frames for chip packaging and particularly discloses a manufacturing method of a lead wire frame for chip packaging. The method comprises the following steps that the upper surface and the lower surface of a whole metal copper foil base body are respectively attached with a dry film layer; by exposure and development, part of a dry film on the upper surface of the metal copper foil base body is removed, so that a metal copper foil part, which needs to be removed by etching, in the lead wire frame is exposed; the exposed metal copper foil part in the previous step is removed by etching through chemical liquid; then a base material layer is bound to the dry film on the upper surface of the metal copper foil base body; and a dry film attached on the lower surface of the metal copper foil base body is removed, so that the lead wire frame is exposed. According to the method, the lead wire frame with high accuracy and an independent welding pad can be obtained, and the requirements for high fineness, multiple pins, small spacing distance and the like of BGA products are met.
Description
technical field [0001] The invention belongs to the technical field of lead frames for chip packaging, and in particular relates to a preparation method for a lead frame for chip packaging. Background technique [0002] The main function of the lead frame is to provide a mechanically supported carrier for the chip, and to form an electrical signal path by connecting the chip circuit inside and outside as a conductive medium, and to dissipate the heat generated by the chip together with the package shell. With the improvement of packaging density, the reduction of packaging volume, and the rapid growth of lead density (the number of leads per unit packaging area), the lead frame is developing in the direction of short, light, thin, high-precision multi-pin, and small pitch. [0003] At present, the production of lead frames mainly includes two methods: the first is stamping, which forms a whole piece of metal sheet through a stamping process, such as my country's patent appli...
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IPC IPC(8): H01L21/48
CPCH01L21/4821
Inventor 崔成强王健
Owner AKM ELECTRONICS INDAL PANYU