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Printed Wiring Board, Printed Circuit Board, And Method For Manufacturing Printed Circuit Board

一种印刷布线板、印刷电路板的技术，应用在印刷电路制造、印刷电路、印刷电路等方向，能够解决不具有电子部件、没有表现出散热效果等问题

Active Publication Date: 2014-06-25
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the technique in Japanese Patent Application Laid-Open No. 2006-303392 does not have a through hole for releasing the heat of the electronic parts to the printed wiring board, and therefore, does not exhibit a sufficient heat dissipation effect

Method used

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  • Printed Wiring Board, Printed Circuit Board, And Method For Manufacturing Printed Circuit Board
  • Printed Wiring Board, Printed Circuit Board, And Method For Manufacturing Printed Circuit Board
  • Printed Wiring Board, Printed Circuit Board, And Method For Manufacturing Printed Circuit Board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0026] Figure 1A and 1B is an explanatory view showing a schematic configuration of the printed circuit board according to the first embodiment of the present invention. Figure 1A is a plan view showing a part of the printed wiring board on which electronic components are mounted; Figure 1B is along the Figure 1A A cross-sectional view of the printed circuit board taken on line A-A. The printed circuit board 300 includes the semiconductor package 200 serving as an electronic component and the printed wiring board 100 . The semiconductor package 200 is mounted on the printed wiring board 100 .

[0027] The semiconductor package 200 is a QFP (Quad Flat Pack) type semiconductor package. The semiconductor package 200 includes a quadrangular (rectangular parallelepiped) package body 201 , a quadrangular heat sink 202 provided on the rear surface (bottom surface) of the package body 201 , and a plurality of leads (electrodes) 203 protruding from the package body 201 . The pac...

no. 2 example

[0065] exist Figure 1A and 1B In the illustrated first embodiment, the pad 161 is formed in the first region R1 directly adjacent to the through hole 121, the pad 162 is formed in the second region R2, and the pad 161 exists in the second region R2 and the between the through holes 121 . However, regarding the second region R2, the pad 161 need not exist between the second region R2 and the through hole 121, but the gap between the through hole 121 and the pad 162 may be a value equal to or greater than a certain value.

[0066] A printed circuit board according to a second embodiment of the present invention will be described below. Figure 4 is a plan view showing a printed wiring board 100H according to the second embodiment. Incidentally, in the second embodiment, the description about the electronic component mounted on the printed wiring board and the solder joint portion connecting the heat sink of the electronic component and the heat transfer pattern of the printed...

no. 3 example

[0079] Next, a printed circuit board according to a third embodiment of the present invention will be described below. Image 6 is a plan view showing a printed wiring board 100A according to a third embodiment of the present invention. Incidentally, in the third embodiment, the description about the electronic component mounted on the printed wiring board and the solder joint portion connecting the heat sink of the electronic component and the heat transfer pattern of the printed wiring board to each other is omitted. In addition, in the printed wiring board, configurations similar to those in the above-described first embodiment are designated by the same reference numerals, and the description will be omitted.

[0080] Further, in the third embodiment, the electronic component is a QFP type semiconductor package having a configuration similar to that of the semiconductor package 200 in the above-described first embodiment, and is mounted on the printed wiring board of the s...

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PUM

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Abstract

A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.

Description

technical field [0001] The present invention relates to a printed wiring board on which an electronic component provided with a heat sink is mounted, a printed circuit board provided with the electronic component, and a method for manufacturing the printed circuit board. Background technique [0002] An electronic component mounted on a printed wiring board and having lead electrodes has a heat sink provided on its face opposite to the printed wiring board. In addition, the printed wiring board has a heat transfer pattern formed on its face opposite to the electronic component. The heat sink of the electronic component and the heat transfer pattern of the printed wiring board are connected by solder paste or the like. [0003] On the other hand, in the case of an electronic part provided with a heat sink and manufactured according to the standard of a conventional lead frame (semiconductor package of QFP type, SOP type, etc.), a gap (stand-off) is formed in the electronic p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K1/18H05K3/34
CPCH05K3/3494H05K1/0201H01L2924/0002H05K1/021H05K1/0206H05K3/3421H05K2201/09781H05K2203/042H05K2203/0465H05K2201/09572H05K1/0209H05K3/3452H05K2201/09618H05K2201/099H05K2201/10969Y10T29/49144H01L2924/00
Inventor 中泽启悟伊藤真
Owner CANON KK
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