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LED lamp strip and forming technology thereof

A technology of LED strip and molding process, applied in the direction of slender light source, lighting device, light source, etc., can solve the problems of LED lamp bead failure, short-circuiting of conductors, short-circuit danger, etc., to save production cost, sealing and waterproofing The effect of good sex and high safety

Inactive Publication Date: 2014-07-02
广东田津电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The surface of the bottom film of the product manufactured by the traditional processing technology has a punching process hole, which is produced when the conductor is punched and cannot be removed
The process holes exposed by the base film are prone to short circuit hazards. During the use of flexible LED strips, the base film will be directly attached to the metal surface. In this use environment, when the metal surface is weathered or oxidized, it will be mixed with liquid. It is easy to short the disconnected conductors, resulting in the hidden danger of short circuit, which will eventually lead to the failure of LED lamp beads

Method used

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  • LED lamp strip and forming technology thereof
  • LED lamp strip and forming technology thereof
  • LED lamp strip and forming technology thereof

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Embodiment Construction

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0034] In this embodiment, refer to Figure 3 ~ Figure 5 , The specific implementation structure of the LED light strip includes a PI film layer 1, a copper conductor layer 2, a PI bottom film layer 3 and an electronic component layer. The manufacturing process is bonded by thermocompression, so the copper conductor layer 2 is thermocompressed between the PI film layer 1 and the PI base film layer 3 .

[0035] The essence of the design of this embodiment is that the PI bottom film layer 3 is a sealed complete plane to prevent the risk of short circuit. Compared with the traditional structure, the PI bottom film layer 3 does not need to punch out process holes to ensure the waterproofness of the PI bottom film. Even if oxidation and water leakage occur, it will not affect the normal operation of the LED strip. The surface of PI m...

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Abstract

The invention discloses an LED lamp strip and a forming technology of the LED lamp strip in the technical field of electronic lighting application. The LED lamp strip is composed of a surface film layer, a conductor layer, a base film layer and an electronic component layer, the conductor layer is arranged between the surface film layer and the base film layer in a hot press fit mode, the base film layer is a sealed complete plane, double-position holes and fabrication holes which are orderly arranged and are used for welding electronic elements are stamped in the surface of the surface film layer, pushing and cutting openings which are arranged orderly are stamped in the surface of the conductor layer, the electronic elements are attached to the position, corresponding to the double-position holes, of the surface of the surface film, the electronic elements are welded with a conductor, the electronic elements exactly cover the surfaces of the fabrication holes, and therefore the fabrication holes are covered. Compared with a traditional lamp strip, no fabrication hole needs to be stamped on the base film layer, the sealing performance and the waterproof performance of the base film layer are ensured, the safety is high, due to the fact that the sealing of a base film is good, various kinds of liquid cannot enter the conductor layer, it is ensured that the LED lamp strip can be used for a long time, and the failure condition cannot happen.

Description

[0001] technical field [0002] The invention relates to the technical field of electronic lighting applications, in particular to an LED light strip and a molding process thereof. Background technique [0003] The flexible LED light strip uses FPC as the assembled circuit board and SMD LEDs for assembly, so that the thickness of the product is only the thickness of a coin and does not take up space; the general specifications are 30cm long, 18 LEDs, 24 LEDs and 50cm long 15 LEDs, 24 LEDs, 30 LEDs, etc. There are also 60cm, 80cm, etc. Different users have different specifications. And it can be cut or extended at will without affecting the luminescence. The FPC material is soft, can be bent, folded, and wound at will, and can be moved and stretched in three-dimensional space without breaking. It is suitable for use in irregular places and places with small spaces, and because it can be bent and wound arbitrarily, it is suitable for arbitrarily combining various patterns i...

Claims

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Application Information

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IPC IPC(8): F21S4/00F21V23/02F21Y101/02F21S4/24F21Y103/10F21Y115/10
Inventor 梅晓鸿吴伟彬
Owner 广东田津电子技术有限公司