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A hermetic packaging structure for surface-mounted semiconductor components

A hermetic packaging and semiconductor technology, applied in the field of electronics, can solve problems such as high cost and difficult combination, and achieve the effect of avoiding difficulty and cost problems and good airtightness

Active Publication Date: 2016-09-28
内蒙航天动力机械测试所
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Problems solved by technology

[0005] The purpose of the present invention is to provide a surface-mounted semiconductor component hermetic packaging structure, which uses metal or ceramic materials for hermetic packaging, and solves the gap between the existing metal and ceramics on the basis of ensuring the reliability of hermetic packaging. Combining difficult, higher cost issues and further increasing semiconductor lifetime

Method used

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  • A hermetic packaging structure for surface-mounted semiconductor components
  • A hermetic packaging structure for surface-mounted semiconductor components
  • A hermetic packaging structure for surface-mounted semiconductor components

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Embodiment Construction

[0022] The present invention will be described in detail below in conjunction with the accompanying drawings and specific examples.

[0023] Referring to the drawings, like numerals indicate like or corresponding parts throughout the drawings. It should be noted that each accompanying drawing only illustrates a specific example of the present invention, and does not limit the protection scope of the present invention.

[0024] figure 1 This is an outline drawing of a surface mount hermetic package. Such as figure 1 As shown, the surface-mounted pin metal sheet 1 of the semiconductor component and the metal wire surface-mounted pin metal sheet 3 are external pins of the surface-mounted hermetic package, forming a heat conduction and conduction path. The metal cover 10 is used to form an airtight packaging shell to protect the internal chip structure from the invasion of external gas, water vapor and other substances. The ceramic bottom plate 5 constitutes the support of the...

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Abstract

The invention discloses a surface mounting semiconductor element hermetic package structure. The structure comprises a substrate, a semiconductor chip, a metal line and a cover. A surface mounting base pin metal sheet and a ceramic base plate are commonly combined to form the surface mounting hermetic packaged substrate, and the surface mounting base pin metal sheet is welded on the ceramic base plate. According to the invention, on the basis that the hermetic package reliability is ensured, the problems of combination difficulty between metal and ceramics and quite high cost are solved, and the service life of a semiconductor is further prolonged.

Description

technical field [0001] The invention belongs to the field of electronics, relates to semiconductor packaging technology, and more specifically relates to a surface mount (surface mount) semiconductor element hermetic packaging structure. Background technique [0002] Semiconductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. The level of packaging technology directly affects the performance of the semiconductor itself and the design and manufacture of the printed circuit board connected to it, and is one of the important technologies in semiconductor manufacturing. The package not only plays the role of installing, fixing, sealing, etc. to protect the chip and enhance the electrothermal performance, but also connects the contacts on the chip to the pins of the package shell with wires, and these pins pass through the printed circuit board. The wires are connected with ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498H01L23/31
CPCH01L2224/48091H01L2224/48228
Inventor 刘立东
Owner 内蒙航天动力机械测试所
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