Integrated power module packaging structure
A packaging structure and power module technology, applied in the direction of output power conversion devices, electrical components, electric solid devices, etc., can solve the problems of large volume and heavy weight of frequency converters, and achieve the effect of reducing volume and improving flexibility
Active Publication Date: 2014-07-23
DELTA ELECTRONICS INC
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Problems solved by technology
However, for traditional inverters, the interior includes power modules, drive substrates, cooling fins and many surrounding electronic components, resulting in the inverter being too bulky and heavy
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[0050] The following will clearly illustrate the spirit of the present invention with the accompanying drawings and detailed description. Any person skilled in the art, after understanding the preferred embodiments of the present invention, can change and modify the technology taught in the present invention without departing from it. The spirit and scope of the present invention.
[0051] Reference figure 1 , Which shows a cross-sectional view of the first embodiment of the integrated power module package structure of the present invention. The integrated power module packaging structure 100 includes a plastic housing 110, stepped pins 120, a first circuit substrate 140 and a second circuit substrate 150. The stepped pin 120 is embedded in the plastic housing 110. The plastic housing 110 has a cavity 112, and the first circuit substrate 140 and the second circuit substrate 150 are accommodated in the cavity 112, and the second circuit substrate 150 is located relatively above t...
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The invention provides an integrated power module packaging structure which comprises a plastic casing body, a number of ladder-shaped pins, a first circuit board and a second circuit board. The ladder-shaped pins are embedded in the plastic casing body. Each ladder-shaped pin comprises a first L-shaped bending part and a second L-shaped bending part, wherein the first L-shaped bending part and the second L-shaped bending part are connected. The plastic casing body comprises a cavity. The first circuit board is accommodated in the cavity. The first circuit board is provided with at least one power component. The first circuit board is electrically connected with at least part of the first L-shaped bending part. The second circuit board is accommodated in the cavity, and is relatively located above the first circuit board. Electronic components are respectively arranged on two surfaces of the second circuit board. The second circuit board is electrically connected with at least part of the second L-shaped bending part.
Description
Technical field [0001] The present invention relates to a packaging structure, and more particularly to an integrated power module packaging structure. Background technique [0002] With the development trend of global automation and power saving and energy saving, speed regulating devices are needed for various applications, so variable frequency drives and motors are used to achieve different speed requirements. However, for traditional inverters, the internal components include power modules, drive substrates, radiating fins, and many peripheral electronic components, resulting in too large volume and heavy weight. With regard to the current development trend of product users, related products are developing in the direction of miniaturization, high power, and high density. Summary of the invention [0003] Therefore, the object of the present invention is to provide an integrated power module packaging structure for integrating the driving substrate and the power components i...
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Login to View More IPC IPC(8): H02M1/00H01L23/31H01L23/48
CPCH01L2924/0002
Inventor 袁德威廖学国周逸凯蔡明原纪伟豪
Owner DELTA ELECTRONICS INC