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Production technology for multilayer circuit board

A multi-layer circuit board and production process technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of complex production process of multi-layer circuit boards, inconvenient production operation control, poor oil removal ability, etc., to achieve strong anti-pollution ability, Easy to make and stable product quality

Active Publication Date: 2014-07-23
广东兴达鸿业电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing multi-layer circuit board production process is generally relatively complicated and cumbersome to manufacture. In the circuit board production process, after copper sinking to the next board surface electroplating process, it needs to be soaked in 0.05-0.1% dilute sulfuric acid potion, Prevent oxidation on the surface of the board and in the hole, and prevent the product from being defective after electroplating; however, dilute sulfuric acid is not strong in removing oil stains and will micro-corrode copper. The soaking time must be controlled within 4 hours, otherwise a thin layer of copper on the hole wall will be micro-corroded In the end, there will be no copper in the hole, and the dilute sulfuric acid potion needs to be changed once every shift
Due to strict time control restrictions, it brings great inconvenience to production operation control, and is prone to quality problems

Method used

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  • Production technology for multilayer circuit board
  • Production technology for multilayer circuit board
  • Production technology for multilayer circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] A production process of a multilayer circuit board, comprising the following steps:

[0095] A. Inner layer cutting:

[0096] Cut the copper clad laminate used to make the inner layer board to the size that meets the design requirements;

[0097] B: inner grinding plate:

[0098] Using grinding equipment to roughen and clean the surface of the copper clad laminate in step A;

[0099] C. Screen printing wet film

[0100] Print a layer of wet film on the copper clad board in step B by silk screen printing;

[0101] D. Drying:

[0102] Drying the copper clad laminate printed with wet film in step C;

[0103] E. Exposure:

[0104] Expose the copper clad laminate in step D to ultraviolet light;

[0105] F. Development:

[0106] Using a developing solution to remove the unexposed wet film layer on the surface of the copper clad laminate in step E;

[0107] G. Etching:

[0108] Use etching solution to remove the exposed part of the copper layer without wet film layer...

Embodiment 2

[0176] A production process of a multilayer circuit board, comprising the following steps:

[0177] A. Inner layer cutting:

[0178] Cut the copper clad laminate used to make the inner layer board to the size that meets the design requirements;

[0179] B: inner grinding plate:

[0180] Using grinding equipment to roughen and clean the surface of the copper clad laminate in step A;

[0181] C. Screen printing wet film

[0182] Print a layer of wet film on the copper clad board in step B by silk screen printing;

[0183] D. Drying:

[0184] Drying the copper clad laminate printed with wet film in step C;

[0185] E. Exposure:

[0186] Expose the copper clad laminate in step D to ultraviolet light;

[0187] F. Development:

[0188] Using a developing solution to remove the unexposed wet film layer on the surface of the copper clad laminate in step E;

[0189] G. Etching:

[0190] Use etching solution to remove the exposed part of the copper layer without wet film layer...

Embodiment 3

[0257] A production process of a multilayer circuit board, comprising the following steps:

[0258] A. Inner layer cutting:

[0259] Cut the copper clad laminate used to make the inner layer board to the size that meets the design requirements;

[0260] B: inner grinding plate:

[0261] Using grinding equipment to roughen and clean the surface of the copper clad laminate in step A;

[0262] C. Screen printing wet film

[0263] Print a layer of wet film on the copper clad board in step B by silk screen printing;

[0264] D. Drying:

[0265] Drying the copper clad laminate printed with wet film in step C;

[0266] E. Exposure:

[0267] Expose the copper clad laminate in step D to ultraviolet light;

[0268] F. Development:

[0269] Using a developing solution to remove the unexposed wet film layer on the surface of the copper clad laminate in step E;

[0270] G. Etching:

[0271] Use etching solution to remove the exposed part of the copper layer without wet film layer...

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PUM

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Abstract

The invention discloses a production technology for a multilayer circuit board. The production technology is characterized by comprising the following steps: A. internal layer material cutting; B. internal layer board grinding; C. wet film silk-screening; D. drying; E. exposure; F. development; G. etching; H. film removing; I. AOI inspection; J. brownification; K. typesetting; L. stitching; M. side routing; N. hole drilling; O. board grinding; P. copper sinking; Q. anti-oxidation processing; R. panel electroplating; S. line board grinding; T; film pasting; U. line exposure; V. line development; W. tin electroplating; X. film removing; Y. etching; Z. tin removing; AA. corrosion inspection; BB. green oil board grinding; CC. green oil; DD. white character silk-screening; EE. surface processing; FF. formation processing; GG. test; HH. FQC; and II. packaging. The invention provides the production technology for the multilayer circuit board with the objective of overcoming defects in the prior art, and the production technology is simple in technology, convenient to process and high in product percent of pass.

Description

technical field [0001] The invention relates to a production process of a multilayer circuit board. Background technique [0002] The existing multi-layer circuit board production process is generally relatively complicated, and it is troublesome to manufacture. In the circuit board production process, after the copper is deposited to the next board surface electroplating process, it needs to be soaked in 0.05-0.1% dilute sulfuric acid potion, Prevent oxidation on the surface of the board and in the hole, and prevent the product from being defective after electroplating; however, dilute sulfuric acid is not strong in removing oil stains and will micro-corrode copper. The soaking time must be controlled not to exceed 4 hours, otherwise a thin layer of copper on the hole wall will be micro-corroded In the end, there will be no copper in the hole, and the dilute sulfuric acid potion needs to be changed once every shift. Due to strict time control restrictions, it brings great ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 王喜
Owner 广东兴达鸿业电子有限公司