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Production technology for high-frequency circuit board

A high-frequency circuit board and production process technology, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of complex production process of high-frequency circuit board, inconvenient production operation control, and cannot exceed 4 hours. Strong pollution ability, good electroplating quality and stable product quality

Active Publication Date: 2014-07-23
广东兴达鸿业电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing high-frequency circuit board production process is generally relatively complicated, and it is troublesome to manufacture. In the circuit board production process, it needs to be soaked in 0.05-0.1% dilute sulfuric acid potion after copper sinking to the next board surface electroplating process. Prevent oxidation on the surface of the board and in the hole, and prevent the product from being defective after electroplating; however, dilute sulfuric acid is not strong in removing oil stains and will micro-corrode copper. The soaking time must be controlled not to exceed 4 hours, otherwise a thin layer of copper on the hole wall will be micro-corroded In the end, there will be no copper in the hole, and the dilute sulfuric acid potion needs to be changed once every shift
Due to strict time control restrictions, it brings great inconvenience to production operation control, and is prone to quality problems

Method used

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  • Production technology for high-frequency circuit board
  • Production technology for high-frequency circuit board
  • Production technology for high-frequency circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] A high-frequency circuit board production process, comprising the following steps:

[0071] A. Cutting material:

[0072] Cut the copper clad laminate to meet the design requirements;

[0073] B: Drilling:

[0074] Drill through holes and punch component holes on both sides of the copper clad laminate;

[0075] C. Grinding plate:

[0076] Use grinding equipment to roughen and clean the surface of the copper clad laminate;

[0077] D. Immersion copper:

[0078] Using chemical methods, a copper layer is deposited on the surface of the copper clad laminate, through holes and component holes;

[0079] E. Anti-oxidation treatment:

[0080] Soak the copper clad laminate in step B in the anti-oxidation potion; wherein the anti-oxidation potion is a sodium carbonate solution with a mass concentration of 0.7%;

[0081] F, plate plating

[0082] Electroplating the entire copper clad laminate to thicken the copper on the board surface, through holes and component holes;

...

Embodiment 2

[0128] A high-frequency circuit board production process, comprising the following steps:

[0129] A. Cutting material:

[0130] Cut the copper clad laminate to meet the design requirements;

[0131] B: Drilling:

[0132] Drill through holes and punch component holes on both sides of the copper clad laminate;

[0133] C. Grinding plate:

[0134] Use grinding equipment to roughen and clean the surface of the copper clad laminate;

[0135] D. Immersion copper:

[0136] Using chemical methods, a copper layer is deposited on the surface of the copper clad laminate, through holes and component holes;

[0137] E. Anti-oxidation treatment:

[0138] Soak the copper clad laminate in step B in the anti-oxidation potion; wherein the anti-oxidation potion is a sodium carbonate solution with a mass concentration of 0.12%;

[0139] F, plate plating

[0140] Electroplating the entire copper clad laminate to thicken the copper on the board surface, through holes and component holes; ...

Embodiment 3

[0186] A high-frequency circuit board production process, comprising the following steps:

[0187] A. Cutting material:

[0188] Cut the copper clad laminate to meet the design requirements;

[0189] B: Drilling:

[0190] Drill through holes and punch component holes on both sides of the copper clad laminate;

[0191] C. Grinding plate:

[0192] Use grinding equipment to roughen and clean the surface of the copper clad laminate;

[0193] D. Immersion copper:

[0194] Using chemical methods, a copper layer is deposited on the surface of the copper clad laminate, through holes and component holes;

[0195] E. Anti-oxidation treatment:

[0196] Soak the copper clad laminate in step B in the anti-oxidation potion; wherein the anti-oxidation potion is a sodium carbonate solution with a mass concentration of 0.15%;

[0197] F, plate plating

[0198]Electroplating the entire copper clad laminate to thicken the copper on the board surface, through holes and component holes;

...

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Abstract

The invention discloses a production technology for a high-frequency circuit board. The production technology is characterized by comprising the following steps: A. material cutting; B. hole drilling; C. board grinding; D. copper sinking; E. anti-oxidation processing; F. panel electroplating; G. line board grinding; H. printing oil curing film pasting; I. line exposure; J. line development; K. copper and tin electroplating; L. film removing; M. etching; N. tin removing; O. etching inspection; P. green oil board grinding; Q. green oil; white character silk-screening; S. surface processing; T. formation processing; U. test; V. FQC; and W. packaging. The invention provides the production technology for the high-frequency circuit board with the objective of overcoming defects in the prior art, and the production technology is simple in technology, convenient to process and high in product qualified rate.

Description

technical field [0001] The invention relates to a high-frequency circuit board production process. Background technique [0002] The existing high-frequency circuit board production process is generally relatively complicated, and it is troublesome to manufacture. In the circuit board production process, it needs to be soaked in 0.05-0.1% dilute sulfuric acid potion after copper sinking to the next board surface electroplating process. Prevent oxidation on the surface of the board and in the hole, and prevent the product from being defective after electroplating; however, dilute sulfuric acid is not strong in removing oil stains and will micro-corrode copper. The soaking time must be controlled not to exceed 4 hours, otherwise a thin layer of copper on the hole wall will be micro-corroded In the end, there will be no copper in the hole, and the dilute sulfuric acid potion needs to be changed once every shift. Due to strict time control restrictions, it brings great inconven...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 王喜
Owner 广东兴达鸿业电子有限公司