Method for coating protective material on chip back and side
A technology for protecting materials and chips, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as low efficiency, easy to miss coating, unevenness, etc., to shorten working hours, save labor, and reduce manufacturing costs Effect
Active Publication Date: 2016-12-07
丽智电子(南通)有限公司
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- Description
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- Application Information
AI Technical Summary
Problems solved by technology
This packaging method is inefficient and prone to omissions or uneven coating
Method used
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Experimental program
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Effect test
Embodiment Construction
[0025] The present invention is described in detail below.
[0026] The method for coating the protective material on the back and side of the chip of the present invention processes the original chip assembly, the chip assembly is a chip board with bumps, the side of the chip board with bumps is the front of the chip board, and the chip board has bumps. The back of one side of the point is the back of the chip board, and the rest of the chip board is the side of the chip board. The specific operation steps are as follows:
[0027] (1) The chip board is placed on the blue film pasting machine, and the first blue film is pasted on the back side of the chip board; the chip board pasted with the first blue film on the back side is placed in the fixed frame, and the periphery of the chip board is close to the fixed frame. The fixed frame is a metal frame or a plastic frame;
[0028] (2) Cut the chip board with the first blue film on the back, and cut the chip board into independ...
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The invention discloses a method for coating the back faces and the side faces of chips with protection materials. The method includes the following operation steps in sequence that firstly, a first blue film is stuck to the back face of a chip board; secondly, the chip board is cut, wherein the chip board is cut into independent chips; thirdly, second blue films are stuck to the front faces of the independent chips; fourthly, the first blue film is taken off; fifthly, the back faces and the side faces of the independent chips are coated with the protection materials and solidified; sixthly, third blue films are stuck to the outer sides of the protection materials; seventhly, the second blue films on the front faces of the independent chips are taken off; eighthly, secondary cutting is performed on the chips coated with the protection materials; ninthly, the chips are taken out, and the independent chips with the back faces and the side faces coated with the protection materials are formed. The method has the advantages that multiple blue films are matched in use, it is ensured that the cut chips are still a whole, overall coating is conducted, labor is saved, labor hours are reduced, and the overall manufacturing cost of the chips is greatly reduced.
Description
technical field [0001] The invention belongs to the technical field of semiconductor chip packaging, and in particular relates to a method for coating protective materials on the back and side surfaces of a chip. Background technique [0002] After the semiconductor chip is processed, it needs to be coated with protective material to achieve the insulation protection function. In the existing known technology, when coating the protective material, the cut chips are sorted one by one onto a specific jig, and then the protective material is evenly coated around the chip to achieve the purpose of insulation protection. This encapsulation method is inefficient and prone to omission or uneven coating. Contents of the invention [0003] In order to solve the deficiencies in the prior art, the object of the present invention is a method for coating protective materials on the back and side surfaces of chips that can be quickly and uniformly coated. [0004] In order to achieve ...
Claims
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IPC IPC(8): H01L21/304H01L21/56H01L21/68
Inventor 黄永发张子岳黄正信刘家宾温国豪邓月忠王焕菊
Owner 丽智电子(南通)有限公司