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Semiconductor device

A semiconductor and overall technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as joint peeling

Inactive Publication Date: 2014-08-13
TOYOTA IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when a heat sink made of metal (aluminum) is used as in the semiconductor device of Patent Document 1, thermal stress may be generated due to the difference in linear expansion coefficient between the circuit board and the heat sink, and there is a possibility that the semiconductor element and the heat sink may be separated. The junction between the circuit boards, the junction between the circuit board and the heat sink is peeled off

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

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Embodiment Construction

[0011] Below, according to figure 1 A semiconductor device according to one embodiment of the present invention will be described.

[0012] Such as figure 1 As shown, the semiconductor device 10 of the present embodiment includes a heat sink 11 as a cooling unit. The heat sink 11 has a base body 11A made of ceramics, and a plurality of refrigerant passages T formed on the base body 11A and flowing refrigerant into the base body 11A. A metal circuit board 14 serving as a circuit board is bonded to a mounting surface (surface to place an object to be cooled) 12 of the heat sink 11 . On the metal circuit board 14, the semiconductor element 13 which is an electronic component is mounted on the element mounting surface 14a. That is, the metal circuit board 14 is directly sandwiched between the heat sink 11 and the semiconductor element 13 . The metal circuit board 14 functions as a wiring layer (electrode) and a bonding layer, and is formed of pure aluminum (for example, 1000 s...

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PUM

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Abstract

This semiconductor device is provided with: a cooling section, which is composed of a ceramic or a resin, and which has a mounting surface; a metal circuit board, which is mounted on the mounting surface of the cooling section, and which has an element mounting surface; and a semiconductor element mounted on the element mounting surface of the circuit board. At least a circuit board portion that corresponds to the element mounting surface is covered with a resin with respect to the cooling section.

Description

technical field [0001] The present invention relates to a semiconductor device having a cooling unit made of ceramics or resin. Background technique [0002] Conventionally, there is known a semiconductor device (semiconductor module) in which a heat sink (radiation fin) is bonded to a circuit board (DBA (Direct Brazed Aluminum) substrate) and modularized. This circuit board is formed by bonding metal plates such as pure aluminum to the front and back surfaces of a ceramic substrate (insulating substrate) such as aluminum nitride. For example, refer to Patent Document 1. In such a semiconductor device, heat generated by a semiconductor element is dissipated by a heat sink. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2006-294699 [0004] However, when a heat sink made of metal (aluminum) is used as in the semiconductor device of Patent Document 1, thermal stress may be generated due to the difference in linear expansion coefficient between the circuit board a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L25/07H01L25/18
CPCH01L24/40H01L23/3121H01L2224/32245H01L2224/40137H01L2224/73215H01L23/373H01L2224/40227H01L23/3735H01L2224/48091H01L23/3731H01L2224/32225H01L2924/1305H01L2224/291H01L24/33H01L23/473H01L23/12H01L24/48H01L2224/73221H01L24/32H01L2224/48227H01L23/49811H01L2224/33181H01L23/3107H01L24/29H01L25/072H01L2224/73265H01L2924/13055H01L24/73H01L2924/181H01L2924/00014H01L2224/371H01L2224/84801H01L2224/83801H01L24/37H01L24/84H01L2924/00H01L2924/014H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
Inventor 岩田佳孝森昌吾上山大藏
Owner TOYOTA IND CORP