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Smart card manufacturing method

A manufacturing method and smart card technology, applied in semiconductor/solid-state device manufacturing, record carriers used by machines, instruments, etc., can solve the problems of reducing thickness and increasing costs

Active Publication Date: 2017-02-08
GEMPLU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The stack appears to be at least 0.15mm thick, thus limiting the possibility of reducing the thickness
[0007] A further disadvantage is that, regardless of the final form, the card body manufactured according to the applicable ISO standard has an expanded form compared to the final form of the SIM card
This method makes it possible to reduce the final thickness of the module to 0.62mm, but it is still necessary to embed the module and therefore have an additional thickness of plastic which is added to the thickness of the module
[0011] Another disadvantage is that the method requires specialized equipment, resulting in increased costs

Method used

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Examples

Experimental program
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Embodiment Construction

[0036] The same elements have the same reference symbols in different figures.

[0037] figure 1 The final form of the smart card 1 is shown in cross-sectional view. The smart card comprises two assemblies: firstly the electronics assembly 2 and secondly the encapsulation 10 . The electronic component assembly 2 comprises a dielectric carrier film 4 having at least one electrical contact area 5 on a first side of the dielectric carrier film 4, an electronic chip 3 being fixed to a second side opposite to the first side. The electronic chip 3 is connected to the electrical contact areas by means of connecting lines 6 which pass through openings 8 in the dielectric carrier film 4 . The assembly of the electronic component assembly on the dielectric carrier film follows methods well known in the electronic data media industry and is not covered by this patent.

[0038] The package body 10 includes a support 7 , a first protective coating 11 and a second protective coating 12 ....

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Abstract

The invention relates to a method of manufacturing a smart card (1) which makes it possible to reduce the thickness of said smart card and directly obtain the final 3FF or 4FF form. The manufacturing method of the smart card comprises the steps of: depositing resin to form a first protective layer (11) on the electronic component assembly, the first protective layer (11) has a larger surface than the required smart card form; and the deposited form is larger than The desired second protective coating in the form of a card is over the first protective coating. The second protective coating is fixed to the first protective coating by curing the first protective coating, and the assembly obtained in the manner described above is then cut into the desired form.

Description

technical field [0001] The invention relates to a manufacturing method of a universal integrated circuit card (Universal Integrated Circuit Card, UICC) 2FF, 3FF or 4FF smart card. The smart card can be, for example, a SIM card. Background technique [0002] The embedding method is usually used when manufacturing SIM cards. The first stage of the process involves encapsulating the electronic component assembly, including integrated circuits and connecting wires, in a resin to protect the components of the electronic module. The encapsulated assembly is then glued into the cavity of a package, which can be made of plastic, for example. The package body is often referred to as the "card body". [0003] As mobile phones are miniaturized and their functions increased, the form of SIM cards has continued to get smaller, as has their thickness. From a 2FF form factor (25x15mm2) to a 3FF form factor (15x12mm2) and soon to a 4FF form factor, the bonding surface and size of the co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
CPCG06K19/077G06K19/07743G06K19/07745H01L2224/48228H01L2924/19107H01L2224/45147H01L2224/45144H01L2224/45124H01L2224/45169H01L2924/00011H01L2924/01005H01L2924/00014G06K19/07722G06K19/07728H01L21/56
Inventor S.奥托邦L.多斯托
Owner GEMPLU