Two-dimensional joint layout design method of packaging shell leads

A technology of encapsulation and design method, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of poor product consistency, difficulty in meeting the needs of mass production of products, low production efficiency, etc. The effect of appearance consistency

Active Publication Date: 2014-08-27
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditionally, single-piece design method is adopted for the racking mode of lead wires of electronic packaging shells. One ceramic component corresponds to one matching lead wire. The consistency of the product is poor, the yield rate is low, and it is difficult to meet the production needs of mass production

Method used

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  • Two-dimensional joint layout design method of packaging shell leads
  • Two-dimensional joint layout design method of packaging shell leads
  • Two-dimensional joint layout design method of packaging shell leads

Examples

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Embodiment Construction

[0015] A certain ceramic component product A, its shape structure and size are as follows figure 2 As shown, its external dimensions include the spacing between the leads X1, the width of the porcelain part Y1,

[0016] (1) The spacing X1 of the metallization pattern corresponding to the lead assembly area of ​​ceramic component product A is 0.4mm, the matching tolerance x' is ±0.03mm, and the spacing X=0.37mm~0.43mm is designed for the top of a single set of leads;

[0017] (2) The length dimension of ceramic component product A perpendicular to the lead wire direction is Y1=2.0mm, the fit tolerance y' is ±0.03mm, and the interval between each group of lead wires in the design row lead wire is Y=1.97mm~2.03mm;

[0018] (3) At the end of the lead, set a connecting rib with a width, through which the lead is connected in a matrix form, according to the spacing X=0.37mm~0.43mm at the top of a single group of leads and the interval between each group of leads Y= 1.97mm~2.03mm, ...

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Abstract

The invention relates to a two-dimensional joint layout design method of packaging shell leads. The method includes the following steps that (1) according to the structure and the boundary dimension of a ceramic component matched with each lead and reasonable dimensional tolerance, the key dimensions X and Y of the leads in joint layout are designed; (2) connecting ribs with certain width are arranged at the ends of the leads, the leads are connected in a matrix mode through the connecting ribs, and according to the X and Y dimensions, the overall design drawing of the leads in two-dimensional joint layout is drawn through AUTOCAD software; (3) according to the layout of the leads in two-dimensional joint layout, the leads are produced and machined; (4) all sets of ceramic components, welding flux, the leads in joint layout and metal press plugs are sequentially arranged on a racking mold according to the design, all the parts are aligned and assembled together according to the center line, and then finished product racking is completed. The two-dimensional joint layout design method of packaging shell leads has the advantages that joint layout design is performed in the matrix mode according to the corresponding interval, multiple ceramic components can be racked at one time, lead racking quality of products is guaranteed, and the yield and the production efficiency of racking are substantially improved.

Description

technical field [0001] The invention relates to a two-dimensional arrangement design method for the lead wires of a packaging case, which realizes a plurality of ceramic components being mounted at one time, and improves product consistency and production efficiency. The invention belongs to the technical field of part design of electronic packaging. Background technique [0002] Traditionally, single-piece design method is adopted for the racking mode of lead wires of electronic packaging shells. One ceramic component corresponds to one matching lead wire. The consistency of the product is poor, the yield is low, and it is difficult to meet the production needs of mass production. Contents of the invention [0003] The invention proposes a two-dimensional wiring design method for package shell leads. Its purpose is to overcome the deficiencies in the existing design, according to the structure and size of the supporting ceramic parts, the ends of the leads are connected...

Claims

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Application Information

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IPC IPC(8): H01L21/50
CPCH01L24/85
Inventor 陈宇宁许丽清程凯夏雨楠李华新
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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