PCB assembly and air-conditioner outdoor unit provided therewith

[0049] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0050] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore It should not be construed as a limitation of the present invention.

[0051]In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0052] In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

[0053] In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

[0054] Refer below Figure 1-Figure 7 The PCB board assembly 100 according to the embodiment of the present invention is described, which is suitable for the electric control box 600 of the outdoor unit 1000 of the air conditioner.

[0055] A PCB board assembly 100 according to an embodiment of the present invention includes a PCB board 1 , a fixing plate assembly 2 and a heating element 3 .

[0056] like figure 1 , figure 2 and Image 6 As shown, the fixed sheet assembly 2 is arranged on the upper surface of the PCB board assembly 100, and the fixed sheet assembly 2 is a metal part. In other words, the fixed sheet assembly 2 is made of metal. For example, the fixed sheet assembly 2 can be a sheet metal part, or fixed The chip assembly 2 can be made of copper, iron, aluminum or silver and other metals with good thermal conductivity and their alloys.

[0057] The heating element 3 is arranged on the upper surface of the fixed piece assembly 2 . It should be noted that the heating element 3 here can be understood as an element that can generate more heat during operation. For example, taking the electric control box 600 of the outdoor unit 1000 of the air conditioner as an example, the electric control box 600 can be provided with a In one embodiment of the PCB board assembly 100, the heating element 3 may be an IPM module, a diode, an IGBT module, a rectifier bridge, and the like.

[0058] The heating element 3 may include pins 33 and a heating module 34 , wherein the pins 33 are fixed on the PCB 1 and electrically connected with the PCB 1 . The heating module 24 has a main heating surface and an auxiliary heating surface. When the heating module 24 works, a large amount of heat is generated. The heat is mainly released from the main heating surface, and the remaining part of the heat is basically released from the auxiliary heating surface.

[0059] In one embodiment of the present invention, the upper surface of the heating element 3 is the main heating surface, and the lower surface thereof is the auxiliary heating surface. 3 Part of the heat generated during work can be better transferred from the metal fixed piece assembly 2 to the PCB board 1 and dissipated, improving the heat dissipation effect of the heating element 3 .

[0060] Of course, it can be understood that for the PCB board assembly 100 applied in different fields and different devices, its heating element 3 can be the same or partly the same or completely different from the above-mentioned IPM module, diode, IGBT module and rectifier bridge. It is easy for those skilled in the art to understand. The above-mentioned use of the heating element 3 as an IPM module, a diode, an IGBT module and a rectifier bridge is only a schematic illustration, and should not be understood as a limitation of the present invention.

[0061] In this way, the heating element 3 is directly arranged on the fixed piece assembly 2 made of metal, which is beneficial for the fixed piece assembly 2 to transfer the heat emitted from the auxiliary heating surface of the heating element 3, that is, the lower surface, to the PCB board 1, and the PCB board 1 It can be a copper circuit board, which has a large surface area and good heat dissipation performance, which is equivalent to increasing the heat dissipation area of ​​the heating element 2, which is conducive to improving heat transfer efficiency so that the fixed sheet assembly 2 can directly transfer the heat from the heating element 3. Timely transfer to the PCB board 1 and dissipate to ensure that the temperature of the heating element 3 should not be too high when it is working.

[0062] According to the PCB board assembly 100 of the embodiment of the present invention, by setting the fixed plate assembly 2 made of metal, the heating element 3 is directly arranged on the fixed plate assembly 2, so that the heat generated by the heating element 3 can be partially passed through the fixed plate assembly. The chip assembly 2 is transferred to the PCB board 1 and released from the PCB board 1, thereby improving the cooling effect of the heating element 3, helping to reduce the temperature of the heating element 3 when it is working, and avoiding the damage of the heating element 3 due to excessive temperature, and In addition, the use of the fixed plate assembly 2 made of metal can also greatly improve the fixing and installation strength of the heating element 3 .

[0063] In addition, the PCB board assembly 100 according to the embodiment of the present invention is especially suitable for the electric control box 600 of the outdoor unit 1000 of the inverter air conditioner, and of course it is also suitable for other equipment with the heating element 3 having a relatively large heat generation.

[0064] like Figure 1-Figure 6 As shown, the PCB board assembly 100 also includes a radiator 4, which is arranged on the upper surface of the heating element 3, that is, the radiator 4 is arranged on the main heat dissipation surface of the heating element 3, so that the heat dissipation effect of the heating element 3 can be greatly improved. For example, in one embodiment of the present invention, the heat sink 4 can include a heat sink substrate 41 and a heat sink 42, and the heat sink substrate 41 can be a flat plate structure so as to form surface-to-surface contact with the upper surface of the heating element 3, increasing both The contact area is beneficial to the heat dissipation of the heating element 3. The cooling fins 42 can be arranged vertically on the upper surface of the heat sink substrate 41 , and the cooling fins 42 can be in multiple groups, and the multiple groups of cooling fins 42 can be arranged in parallel to further increase the heat dissipation effect of the heating element 3 .

[0065] By setting the radiator 4, the heat dissipation effect of the heating element 3 can be further improved. Specifically, part of the heat generated by the heating element 3 can be dissipated through the radiator 4, and the other part can be dissipated through the fixed piece assembly 2 and the PCB board. 1 is dissipated, so that the heat generated by the heating element 3 of the PCB board assembly 100 according to an embodiment of the present invention can be dissipated quickly and in time, so that the PCB board assembly 100 is in a suitable working temperature range, and the work efficiency is improved , while reducing the failure rate and cost, the practical effect is good.

[0066] In one embodiment of the present invention, the fixing piece assembly 2 includes a base plate 21 and a support piece 22 . like Figure 1-Figure 2 , Figure 4-Figure 6 As shown, the substrate 21 is arranged on the upper surface of the PCB board 1 and the lower surface of the substrate 21 is in close contact with the upper surface of the PCB board 1 . In this way, the heat transfer efficiency can be improved, so that the heat transferred from the heating element 3 to the substrate 21 of the fixed sheet assembly 2 can be better transferred to the PCB board 1 and dissipated from the PCB board 1 .

[0067] The supporting piece 22 is connected with the base plate 21 and the lower surface of the supporting piece 22 is spaced a predetermined distance from the upper surface of the PCB 1 , wherein the heating element 3 is fixed on the supporting piece 22 . With this design method, the heating element 3 can have a certain adjustment margin in the up and down direction, so as to adapt to the installation and fixing of the heating element 3 and the supporting plate 22 of different sizes and weights, which is beneficial to improve the installation efficiency.

[0068] There are many ways to fix the radiator 4 , the heating element 3 and the fixed plate assembly 2 . For example, in one embodiment of the present invention, the PCB board assembly 100 further includes a fixing bolt 5 , and the fixing bolt 5 passes through the heat sink 4 , the heating element 3 and the supporting piece 22 in turn and is fixed on the PCB board 1 .

[0069] Specifically, refer to figure 1 As shown, the heating element 3 is provided with a fixing through hole 31 that passes through it in the thickness direction of the heating element 3, that is, in the up and down direction, and is suitable for cooperating with the fixing bolt 5. The fixing through hole 31 can be a circular through hole, so The fixing bolt 5 can pass through the radiator substrate 41 of the radiator 4 first, then pass through the fixing through hole 31 and the supporting plate 22, and finally the free end of the fixing bolt 5 can be threadedly connected with the PCB board 1 to realize fixing.

[0070] Again, refer to figure 1 As shown, the heating element 3 can be in the shape of a plate, such as a substantially rectangular plate. The outer peripheral surface of the heating element 3 is provided with a limit notch 32 suitable for cooperating with the fixing bolt 5. The horizontal section of the limit notch 32 is It can be a semicircle, or a circle with a notch, so that the fixing bolt 5 first passes through the radiator base plate 41 of the radiator 4, then passes through the limit notch 32 and the bracket 22, and finally the fixing bolt 5 The free end can be connected with the thread of the PCB board 1 to realize fixing.

[0071] Further, there may be two limiting notches 32 and the two limiting notches 32 are arranged symmetrically on the heating element 3. It should be noted that at this time, the fixing bolt 5 penetrates the heating element 3 from both sides. In order to realize the fixing effect on the heating element 3 through the limitation of the fixing bolt 5 . Of course, it can be understood that there may be more limiting notches 32 .

[0072] In order to further improve the fixing strength of the radiator 4 and the heating element 3 , in a preferred embodiment of the present invention, the substrate 21 is also provided with soldering feet 211 for fixing the substrate 21 on the PCB 1 by wave soldering. Specifically, the PCB board 1 is pre-opened with holes, and the lower surface of the substrate 21 is provided with a metal welding foot 211. The free end of the metal welding foot 211 passes through the hole on the PCB board 1, and then the metal is welded by wave soldering. The feet 211 are fixed with corresponding holes. Of course, it can be understood that the base plate 21 can also be fastened to the PCB board by bolts or screws.

[0073] Thus, on the one hand, the overall fixing strength of the fixed plate assembly 2, the heating element 3, the radiator 4 and the PCB board 1 is improved; In this way, the heat of the fixed piece assembly 2 can be directly transferred to the PCB board 1 through the metal welding pin 211 and metal tin (metal tin solidified after the welding process), thereby increasing the heat dissipation effect of the heating element 3 .

[0074] Furthermore, the metal soldering feet 211 penetrate the PCB board assembly 100 and are at least partially exposed from the lower surface of the PCB board 1 . This can not only further improve the fixing strength between the fixed piece assembly 2, the heating element 3 and the radiator 4 and the PCB board 1, but also the tin liquid can be better formed on the protruding part of the metal soldering foot 211 protruding from the lower surface of the PCB. Around, increasing the contact heat dissipation area with the PCB board 1 further improves the heat dissipation effect of the heating element 3 .

[0075] There can be a plurality of metal welding feet 211, and the plurality of metal welding feet 211 can be evenly distributed on the lower surface of the substrate 21, thereby further improving the fixing strength and heat generation of the fixed sheet assembly 2, the heating element 3 and the radiator 4 The cooling effect of element 3.

[0076] It should be noted that wave soldering is a prior art and is well known to those skilled in the art, and will not be described in detail here for the purpose of brevity.

[0077] In one embodiment of the present invention, the support piece 22 is elastically connected to the base plate 21 . Here, it should be noted that the "elastic connection" here can be understood as that the supporting piece 22 can swing in a small vertical direction relative to the base plate 21 . In this way, the heating element 3 can have a certain adjustment margin in the up and down direction, so as to better adapt to the installation and fixing of the heating element 3 and the support piece 22 of different sizes and weights.

[0078]For example, in one embodiment of the present invention, the part of the support piece 22 that is connected to the base plate 21 is narrowed (ie figure 1 23), in other words, the size of the connecting part between the support piece 22 and the base plate 21 is smaller than the size of the support piece 22, which can increase the elasticity of the support piece 22 and increase the adjustment margin of the heating element 3 to a certain extent. The range of the amount is better adapted to the installation and fixation of heating elements 3 and brackets 22 of different sizes and weights.

[0079] In one embodiment of the present invention, the thickness of the support piece 22 is related to the narrowed portion (i.e. figure 1 The thicknesses of 23) are equal, and the thickness of the support piece 22 is smaller than the thickness of the substrate 21 . In this way, on the one hand, the overall manufacturing of the supporting piece 22 and the narrowed portion is facilitated, and on the other hand, the supporting piece 22 has good elasticity relative to the base plate 21 . Preferably, the support piece 22, the narrowed part and the base plate 21 are integrally formed, which can simplify the manufacturing process of the fixed piece assembly 2, facilitate production and processing, reduce costs, and at the same time help to improve the overall strength of the fixed piece assembly 2 and reduce the size of the fixed piece assembly. Component 2 damage chance.

[0080] According to an embodiment of the present invention, such as figure 1 As shown, the base plate 21 of the fixed plate assembly 2 can be formed in a flat shape. Alternatively, the base plate 21 can also be formed in a substantially U-shaped frame shape, and three supporting pieces 22 can be arranged side by side on the U-shaped base plate 21 , and a heating element 3 can be arranged on each supporting piece 22 . Certainly, it can be understood that, for those skilled in the art, on the basis of reading the content disclosed here in the specification, the carrier sheet 22 according to an embodiment of the present invention can be processed into a desired shape, such as a plate shape, frame shape or other shapes, and one or more supporting pieces 22 can be set on each substrate 21 as required, it can be understood that, in this embodiment, the supporting pieces 22 and the heating element 3 can be in one-to-one correspondence . Of course, the present invention is not limited thereto. In other embodiments of the present invention, multiple supporting pieces 22 can also be used to install and fix one heating element 3 , for example, two supporting pieces 22 are used to fix one heating element 3 .

[0081] Generally speaking, the PCB board assembly 100 according to an embodiment of the present invention can greatly improve the heat dissipation effect of the heating element 3, fully reduce the working temperature of the heating element 3, and at the same time, it is easy to assemble, securely fixed, has good practicability and has a wide range of applications.

[0082] Refer below Figure 7 An outdoor unit 1000 of an air conditioner according to an embodiment of the present invention will be described.

[0083] An outdoor unit 1000 of an air conditioner according to an embodiment of the present invention includes an outdoor unit housing 200 , a compressor 300 , a fan 400 , a partition 500 and an electric control box 600 .

[0084] like Figure 7 As shown, the outdoor unit casing 200 can be formed in a rectangular parallelepiped shape, which can be fixed on the outdoor wall by a bracket, and the outdoor unit casing 200 has a chamber 210 inside. Both the compressor 300 and the blower 400 are disposed in the chamber 210 . The partition 500 is arranged in the chamber 210 and isolates the chamber 210 into a compressor chamber 2110 and a fan chamber 2120. For example, the partition 500 can be vertically arranged in the chamber 210, and its lower end can be close to the chamber 210 The bottom wall of the compressor 300 is located in the compressor chamber 2110 and the fan 400 is located in the fan chamber 2120 at a certain distance from the top wall of the chamber 210 , and the upper end thereof may be separated by a certain distance.

[0085] The electric control box 600 is arranged on the upper end of the partition 500 and includes the electric control box housing 610 and the PCB board assembly 100 arranged in the electric control box housing 610, wherein the PCB board assembly 100 is described in the above-mentioned embodiments according to the present invention The PCB board assembly 100. An air inlet 6110 communicating with the compressor chamber 2110 and an air outlet 6120 communicating with the fan chamber 2120 are formed on the electric control box housing 610 .

[0086] Since the fan chamber 2120 is provided with a fan 400, the fan 400 will form a negative pressure during operation, so that the air pressure in the fan chamber 2120 is lower than the air pressure in the compressor chamber 2110. Under the effect of the pressure difference, the air will flow from The compressor chamber 2110 enters the electric control box 600 through the air inlet 6110, flows through the PCB board 1, the fixed plate assembly 2 and the heating element 3, and takes away the heat generated by the heating element 3 during operation, and finally flows through the air outlet 6120 flows into fan chamber 2120.

[0087] According to an embodiment of the present invention, the PCB board assembly 100 includes a radiator 4 disposed on the upper surface of the heating element 3 . The fixing piece assembly 2 includes: a base plate 21 and a supporting plate 22 , the base plate 21 is arranged on the upper surface of the PCB 1 and the lower surface of the base plate 21 is in close contact with the upper surface of the PCB 1 . The support piece 22 is connected to the base plate 21 and the lower surface of the support piece 22 is spaced a predetermined distance from the upper surface of the PCB board 1, wherein the heating element 3 is fixed on the support piece 22, wherein the air flow entering the electric control box 600 from the air inlet 6110 Through the PCB board 1 , the fixed piece assembly 2 and the gap between the PCB board 1 and the supporting piece 22 .

[0088] In other words, the relatively low-temperature air in the compressor chamber 2110 can enter the electric control box housing 610 from the air inlet 6110. On the one hand, this part of the air flows through the PCB board 1 to take away the heat produced by the PCB board 1 during operation. On the other hand, this part of the air will also flow through the fixed plate assembly 2, so that the heat transferred from the heating element 3 to the fixed plate assembly 2 can be better dissipated into the air. On the other hand, this part of the air will flow from the support plate 22 The gap between the PCB and the PCB board 1 flows through, thereby taking away the heat of the supporting plate 22 more fully, maximizing the cooling effect on the heating element 3, avoiding the damage of the heating element 3 due to excessive working temperature, and improving the temperature of the heating element 3 service life.

[0089] It can be understood that other components of the outdoor unit 1000 of the air conditioner according to the embodiment of the present invention, such as an evaporator, and operations are known to those skilled in the art, and will not be described in detail here.

[0090] In the description of this specification, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0091] Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.