Silicon wafer separating device

Abstract

The invention discloses a silicon wafer separating device which comprises a feeding unit, a suction unit and a negative pressure unit. The negative pressure unit comprises a negative pressure box, at least one air suction hole formed in the negative pressure box, a sealing box body, an air suction pump and an infusion pump, wherein the air suction pump and the infusion pump are connected with the sealing box body. The air suction holes are communicated to the sealing box body. Negative pressure suction holes are communicated with the negative pressure box. The negative pressure box is partially located inside a water groove. At least one air suction hole is located above the position close to the water surface in the water groove. According to the silicon wafer separating device, silicon wafers are separated in water and are sucked and conveyed through negative pressure power, gas and liquid are separated by the sealing box body, the air suction pump and the infusion pump, the air suction pump and the infusion pump are connected with the sealing box body, water obtained after separation is sent back into the water groove so as to keep the water amount in the water groove for facilitating silicon wafer separation, the negative pressure pumping space in the sealing box body is ensured, then the suction force of the negative pressure suction holes is improved, meanwhile, the negative pressure pumping volume in the negative pressure box can be utilized to the large extent, the negative pressure working efficiency is improved, the structure is reliable, and the silicon wafer separating device is suitable for application and popularization.

Description

technical field [0001] The invention relates to a silicon chip processing equipment, in particular to a slicing device for slicing underwater. Background technique [0002] Before inserting the silicon wafers, the stacked silicon wafers should be divided into slices. Since the silicon wafers are light and fragile, and there is a certain amount of adsorption between adjacent silicon wafers, the slices are chosen to be divided in water. When slicing, negative pressure adsorption is generally used to achieve slicing and transportation, which will cause part of the water in the tank to be pumped out with the negative pressure, which will cause the water in the tank to decrease continuously, which is not conducive to slicing. In addition, it will also Affect the efficiency of negative pressure adsorption. Contents of the invention [0003] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide a slicing device, which can separ...

AI Technical Summary

Problems solved by technology

[0002]Before inserting silicon wafers, the stacked silicon wafers must be sliced ​​first, and because the silicon wafers are light and fragile, and the adjacent silicon wafers There is a certain adsorption force between them, so we choose to divide the pieces in water. When dividing the pieces, negative pressure adsorption is generally used to realize the separation and transportation. This will cause part of the water in the tank to be drawn out with the negative pressure, which will cause the water tank The continuous reduction of water in the film is not conducive to fragmentation. In addition, it will also affect the efficiency of negative pressure adsorption.

Images