Flip-chip cob light source for stage lights and its production process

Abstract

The invention discloses a stage light flip-chip chip-on-board (COB) light source and a production process thereof. The production process of the stage light flip-chip chip-on-board light source includes the following steps that: a flip chip is arranged on a die bonding area of an aluminum nitride ceramic support in a flip manner through adopting an eutectic furnace, so that an eutectic process can be completed, and an eutectic support can be formed; ultrasonic cleaning is performed on the eutectic support which has been subjected to the eutectic process; primary baking, enclosure glue enclosing, secondary baking and cooling are sequentially performed on the cleaned eutectic support; the enclosure glue forms a blocking wall structure along an enclosing dam around the die bonding area; the flip chip on the eutectic support is evenly coated with fluorescent powder glue, and baking is performed, and then, a chip encapsulation block can be formed; the chip encapsulation block is connected into a sink stage of a pure copper substrate through reflow soldering; and optical glass with high light transmittance and low reflectivity is bonded at a position right above the chip encapsulation block. The stage light flip-chip chip-on-board light source and the production process thereof of the invention have the advantages of excellent thermoelectric separation effect, firm combination and little possibility of falling off of the chip, high luminous flux, excellent lighting effect, advanced production techniques, high production efficiency and the like.

Description

technical field [0001] The invention relates to a production process of a COB light source, in particular to a stage light flip-chip COB light source and a production process thereof. Background technique [0002] At present, most of the COB light source products on the market are directly bonded on aluminum substrates, and a small part are directly bonded on copper substrates and ceramic substrates; the materials used for bonding are insulating glue and silver glue, and their thermal resistance is average. At 12°C / W, the thermal resistance is relatively high; in addition, the COB light source products on the market all use the wire bonding process, and the COB light source produced by the wire bonding process cannot withstand large pulse currents, let alone operate under large currents. Working for a long time under the driving of the pulse; the gold wire of the product and the P-N junction of the chip will be greatly affected due to excessive pulse current or long-term hig...

AI Technical Summary

Problems solved by technology

[0002] At present, most of the COB light source products on the market are directly bonded on aluminum substrates, and a small part are directly bonded on copper substrates and ceramic substrates; the materials used for bonding are insulating glue and silver glue, and their thermal resistance is average. At 12°C / W, the thermal resistance is relatively high; in addition, the COB light source products on the market all use the wire bonding process, and the COB light source produced by the wire bonding process cannot withstand large pulse currents, let alone operate under large currents. Working for a long time under the driving of the pulse; the gold wire of the product and the P-N junction of the chip will be greatly affected due to excessive pulse current or long-term high-current (1000mA) work, which will easily cause problems such as disconnection, dead lights and rise in chip junction temperature; Moreover, the COB light source products on the market all adopt the way of wall glue for dispensing fluorescent glue. When the light source is working, the glue is easy to be heated and expanded, causing the gold wire to break and the broken wire to die.

Therefore, in summary, the existing COB light source products have the following defects in structure or production process: silver glue or insulating glue solid crystal, not only makes the chip fall off due to environmental influences, but also has chips, silver glue and brackets. The problem of inconsistent thermal expansion coefficient, the problem of the bonding force between the silver glue and the chip and the bracket, and the cumbersome use of wiring, etc.

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