Forming and milling method of dbc ceramic substrate

Abstract

The invention provides a molding and milling-cutting method of a DBC ceramic substrate. The molding and milling-cutting method of the DBC ceramic substrate comprises the steps of performing graph production on the ceramic substrate, wherein a milling-cutting positioning target is manufactured on a copper coated frame on the periphery of a unit plate, copper avoiding treatment is adopted at a position of the copper coated frame corresponding to a unit plate milling-cutting line, the unit plate milling-cutting line is an epitaxy line along the unit plate edge line and the edge, and the epitaxy line extends to a mother blank boundary; arranging first face patterns on the first face of the unit plate and arranging second face patterns on the second face, wherein the first face patterns and the second face patterns are arranged in the horizontal direction and the vertical direction of a ceramic mother blank in a staggered mode; performing surface treatment on the ceramic substrate; performing molding, milling and cutting on the ceramic substrate along the unit plate milling-cutting line and reserving the residual unit plate for certain thickness; performing manual and direct folding so as to separate the unit plate.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, and more specifically, the invention relates to a forming and milling method of a DBC (Direct bond Copper, directly bonded copper) ceramic substrate. Background technique [0002] DBC ceramic master board is to use DBC technology to directly sinter copper foil to Al 2 o 3 Or a composite copper-clad ceramic plate made of AlN ceramic surface, which has the characteristics of high thermal conductivity, high electrical insulation, large current capacity, high mechanical strength, and temperature characteristics matching silicon chips. [0003] Graphic circuit boards manufactured from DBC ceramic motherboards are called DBC ceramic substrates, which are often used as power device substrates in the field of electronic packaging. The common specification of DBC ceramic motherboard is 138mm*190mm, and the size of DBC ceramic substrate design is usually small. When manufacturing DBC ceram...

AI Technical Summary

Problems solved by technology

However, when manually pulling out the unit board, a certain force needs to be applied, and the corners of the board are subject to greater stress, which is prone to cracking and missing corners, and the ceramic substrate is scrapped.

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