Device package structure with heat radiating structure and manufacturing method thereof
A technology of device packaging and heat dissipation structure, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of high cost of flip-chip plastic packaging structure, poor signal shielding effect, poor grounding performance, etc. Effective heat dissipation and normal operation, good grounding performance and low cost
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Embodiment 1
[0028] In order to enable those skilled in the art to understand the present invention in more detail, the present invention will be described in detail below in conjunction with the accompanying drawings.
[0029] Such as figure 1 said, figure 1 It is a flip-chip plastic packaging structure with a heat dissipation structure in an embodiment of the present invention, wherein the structure includes:
[0030] Chip 1;
[0031] A substrate 2, the first surface 21 of the substrate 2 is provided with the chip;
[0032] Height-limiting bumps 6, the height-limiting bumps 6 are arranged on the first surface 21 of the substrate 2;
[0033] A heat dissipation plate 3, the heat dissipation plate 3 is arranged on the chip 1 and the height-limiting bump 6, and the heat dissipation plate 3 is connected to the first surface 21 of the substrate 2, the height-limiting bump 6, The chip 1 forms a first space 4; the height-limiting bump 6 is connected to the heat dissipation plate 3, so that t...
Embodiment 2
[0045] Such as Figure 2-8 As shown, the embodiment of the present invention also provides a method for manufacturing a device package with a heat dissipation structure, the method comprising:
[0046] Step 110: planting height-limiting bumps 6 on the first surface 21 of the substrate 2;
[0047] Step 120: paste the chip 1 on the first surface 21 of the substrate 2;
[0048] Step 130: Put the cooling plate 3 on the height-limiting bump 6 and the chip 1, and bond the cooling plate 3, the chip 1, and the height-limiting bump 6 through reflow;
[0049] Step 140: filling the molding resin 5;
[0050] Step 150 : Plant balls on the second surface 22 of the substrate 2 to form ground bumps 7 .
[0051] Further, the step 140 of filling the molding resin 5 also includes:
[0052] Plastic material is poured into the encapsulation by capillary action.
[0053] Eliminate air bubbles during the potting process by vacuum exhaust.
[0054] Further, in step 130, place the heat dissipati...
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