LED bracket with good moisture-proof performance, LED device and preparation method thereof
A technology of LED bracket and moisture-proof performance, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of increased contact resistance, increased VF, failure of LED light sources, etc., and achieves increased water vapor infiltration paths and enhanced high temperature resistance reliability. , the effect of improving long-term reliability
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Embodiment 1
[0050] Such as figure 2 As shown, this embodiment discloses a LED bracket with good moisture-proof performance, including a first pad 201 and a second pad 202 as conductive pins, and a reflective cup 209 arranged on the pads. The pad 201 and the second pad 202 are connected through an insulating block 203 , and the first pad 201 and the second pad 202 are located on the same horizontal plane, which jointly constitute the bottom plate of the LED bracket. When in use, the first pad 201 and the second pad 202 are electrically connected to the two electrodes of the LED chip, and play the role of a support and conductive pin, and the external power is supplied to the LED through the first pad 201 and the second pad 202 The chip is powered, and the connection structure between the pad and the external power supply can be a conventional structure such as a bump on the edge of the pad.
[0051] Such as figure 2 As shown, on the contact surfaces of the first pad 201 and the second ...
Embodiment 2
[0065] Such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that a roughened structure layer is provided on the upper surface and the outer sidewall of the metal bumps (the first metal bumps 204 and the second metal bumps 205 ). Specifically, the roughened structure layer 2041 can be corrugated or sawtoothed, etc. The existence of the roughened structure 2041 has at least two advantages: on the one hand, it can prolong the path for the water vapor in the environment to penetrate into the LED bracket, and enhance the airtightness; On the one hand, since the reflective cup 209 is thermoplastic plastic such as PPA and thermosetting plastic, the bonding force between the plastic and the metal copper sheet is poor, and the existence of the roughened structure increases the contact area between the two, and the bonding force between the two is strengthened, so that this implementation The strength and airtightness of the stent structure of the examp...
Embodiment 3
[0067] LED devices are generally non-airtight packages. The bracket bowl cup is filled with a mixture of silica gel and phosphor powder. There is a contact interface between the silica gel phosphor powder mixture and the reflective cup of the bracket. Water vapor above the space of the LED device can easily penetrate into the LED bracket through this interface. In the bowl cup, thereby corroding the silver plated layer of the bracket, causing dead lights and other phenomena. Such as Figure 5 As shown, the difference between this embodiment and Embodiment 2 is that an engaging groove 210 recessed into the side wall of the reflective cup is provided on the upper opening edge of the reflective cup 209 . The occlusal groove 210 increases the contact area between the reflective cup 209 of the bracket and the silica gel fluorescent powder mixture, which not only increases the bonding force between the two, but also prolongs the water vapor infiltration path above the space of the L...
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