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LED bracket with good moisture-proof performance, LED device and preparation method thereof

A technology of LED bracket and moisture-proof performance, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of increased contact resistance, increased VF, failure of LED light sources, etc., and achieves increased water vapor infiltration paths and enhanced high temperature resistance reliability. , the effect of improving long-term reliability

Active Publication Date: 2014-09-24
APT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After water vapor penetrates into the LED bowl, it adheres to the gold wire of the LED, corrodes the gold wire, increases the contact resistance, and increases the VF; at the same time, the water vapor will corrode the silver-plated layer, affecting the connection between the second welding of the gold wire and the silver-plated layer of the bracket. The binding force, resulting in LED dead light
[0005] In addition, for the LED flat-panel structure bracket light source injection molded by nylon-based polymers (PPA, PA9T, PA6T, PA), the light and heat generated by the LED chip directly contact the polymer when the power is turned on, making the polymer resin Degradation, the heat resistance of the insulating reflective cavity of the LED bracket is reduced, and yellowing and blackening gradually occur, resulting in the failure of the LED light source
Especially high-energy LED chips such as ultraviolet LEDs have exacerbated the deterioration of LED nylon-based polymer plastic brackets

Method used

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  • LED bracket with good moisture-proof performance, LED device and preparation method thereof
  • LED bracket with good moisture-proof performance, LED device and preparation method thereof
  • LED bracket with good moisture-proof performance, LED device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Such as figure 2 As shown, this embodiment discloses a LED bracket with good moisture-proof performance, including a first pad 201 and a second pad 202 as conductive pins, and a reflective cup 209 arranged on the pads. The pad 201 and the second pad 202 are connected through an insulating block 203 , and the first pad 201 and the second pad 202 are located on the same horizontal plane, which jointly constitute the bottom plate of the LED bracket. When in use, the first pad 201 and the second pad 202 are electrically connected to the two electrodes of the LED chip, and play the role of a support and conductive pin, and the external power is supplied to the LED through the first pad 201 and the second pad 202 The chip is powered, and the connection structure between the pad and the external power supply can be a conventional structure such as a bump on the edge of the pad.

[0051] Such as figure 2 As shown, on the contact surfaces of the first pad 201 and the second ...

Embodiment 2

[0065] Such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that a roughened structure layer is provided on the upper surface and the outer sidewall of the metal bumps (the first metal bumps 204 and the second metal bumps 205 ). Specifically, the roughened structure layer 2041 can be corrugated or sawtoothed, etc. The existence of the roughened structure 2041 has at least two advantages: on the one hand, it can prolong the path for the water vapor in the environment to penetrate into the LED bracket, and enhance the airtightness; On the one hand, since the reflective cup 209 is thermoplastic plastic such as PPA and thermosetting plastic, the bonding force between the plastic and the metal copper sheet is poor, and the existence of the roughened structure increases the contact area between the two, and the bonding force between the two is strengthened, so that this implementation The strength and airtightness of the stent structure of the examp...

Embodiment 3

[0067] LED devices are generally non-airtight packages. The bracket bowl cup is filled with a mixture of silica gel and phosphor powder. There is a contact interface between the silica gel phosphor powder mixture and the reflective cup of the bracket. Water vapor above the space of the LED device can easily penetrate into the LED bracket through this interface. In the bowl cup, thereby corroding the silver plated layer of the bracket, causing dead lights and other phenomena. Such as Figure 5 As shown, the difference between this embodiment and Embodiment 2 is that an engaging groove 210 recessed into the side wall of the reflective cup is provided on the upper opening edge of the reflective cup 209 . The occlusal groove 210 increases the contact area between the reflective cup 209 of the bracket and the silica gel fluorescent powder mixture, which not only increases the bonding force between the two, but also prolongs the water vapor infiltration path above the space of the L...

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Abstract

The invention discloses an LED bracket with good moisture-proof performance, an LED device and a preparation method thereof. The LED bracket comprises as a first pad and a second pad as conductive pins and reflective cups arranged on the pads. The first pad and the second pad are connected through an insulation block. The contact surfaces of the first pad and the second pad with the bottoms of the reflective cups are provided with metal lugs, and the metal lugs and the pads are integrally formed. Reflective side walls are formed by the inner side walls of the metal lugs and the inner walls of the reflective cups. The upper surfaces of the metal lugs are tightly attached with outer side walls and the bottom of the reflective cup, the outer side walls of the metal lugs are tightly attached with the bottoms of the reflective cups. The first pad and the second pad are also provided with water-adsorbing grooves which are arranged around the periphery of the metal lugs. Water-adsorbing material layers are filling the water-adsorbing grooves and are covered by the bottoms of the reflective cups. According to the LED bracket with good moisture-proof performance, the LED device and the preparation method, double water resistance with the use of the metal lugs and the water-adsorbing material layers in the water-adsorbing grooves is used, and the LED bracket and a package device with good moisture-proof performance and high reliability are obtained.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to an LED bracket with good moisture-proof performance, an LED device and a preparation method thereof. Background technique [0002] The packaging structure of Surface Mounted Devices (SMD) fits the lm / $ LED development trend because of its small size, suitable for mass production, high cost performance, and compatibility with mature surface mount technology (SMT). extensive customer support. When the driving power of a single LED light source increases, the heat increases significantly. In order to maintain the photoelectric conversion efficiency of the LED chip, it is necessary to maintain a low junction temperature. [0003] In order to achieve the above purpose, bracket companies try to increase the area of ​​the bracket cooling block to improve heat dissipation, so a SMD bracket called a flat structure has become the mainstream structure. Such as figure 1 As shown,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/486H01L33/60H01L33/62H01L2933/0033H01L2933/0058H01L2933/0066
Inventor 何贵平陈海英姜志荣肖国伟
Owner APT ELECTRONICS
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