Electroluminescent device, preparation method thereof and display device

Abstract

Provided is an electroluminescent device comprising: a substrate base plate; an illumination unit disposed on a surface of the substrate; and an encapsulation layer encapsulating the illumination unit; wherein the encapsulation layer comprises an inorganic encapsulation film alternately stacked and an organic-inorganic composite layer comprising methyl-modified nano-inorganic particles and a polymer material. The encapsulation structure of the flexible OLED provided by the invention has the characteristics of low cost, high resistance to water and oxygen, bending resistance, good flexibility, light enhancement effect, etc., and overcomes the shortcomings of high rigidity, high cost, easy damage and the like of the glass package and the inorganic film package.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to an electroluminescence device, a preparation method thereof and a display device. Background technique [0002] Flexible Organic Light-Emitting Diode (FOLED) has the advantages of self-luminous display, fast response, high brightness, and wide viewing angle. Moreover, FOLED is a display based on organic materials, without liquid filling, can be rolled, folded, and even worn, etc., which is a very good portable product. [0003] However, the current FOLEDs mostly use inorganic multilayer thin films (SiO x , SiN x ) for staggered stack packaging. However, the CVD film formation temperature of the inorganic film silicon nitride and silicon oxide is relatively high and will cause certain damage to the device and affect the performance of the device. Moreover, certain pinholes (pin holes) will be generated during the CVD process, which will affect the packaging effect...

AI Technical Summary

Problems solved by technology

However, the CVD film formation temperature of inorganic film silicon nitride and silicon oxide is relatively high and will cause certain damage to the device, affecting the performance of the device

And the CVD process will produce a certain pinhole (pin hole), which affects the packaging effect of the device

The aluminum oxide film is introduced to cover the pinholes generated in the CVD process, but because the inorganic film is too rigid, the flexible OLED device packaged with the inorganic film overlapping each other cannot be bent excessively, and certain cracks will occur after long-term stress bending

Therefore, the alternation of inorganic and organic has become a trend of OLED encapsulation, but the ability of blocking water and oxygen in many alternating modes is greatly reduced due to the insufficient affinity of organic and inorganic membrane surfaces.

In addition, in order to improve the light extraction efficiency of OLED devices, the mode of doping inorganic particles with organic materials is used, which also leads to poor flexibility due to insufficient interface affinity.

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