Electroluminescence device, its manufacturing method and display device

Abstract

An electroluminescent device is provided, comprising: a base substrate; a light-emitting unit disposed on the surface of the base substrate; and an encapsulation layer encapsulating the light-emitting unit; wherein the encapsulation layer includes alternately stacked inorganic encapsulation films and An organic-inorganic composite layer, the organic-inorganic composite layer includes methyl-modified nano-inorganic particles and polymer materials. The packaging structure of the flexible OLED provided by the invention has the characteristics of low cost, high resistance to water and oxygen, bending resistance, good flexibility, and light-enhancing effect, and overcomes the strong rigidity, high cost, and easily damaged devices of glass packaging and inorganic thin film packaging. insufficient.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to an electroluminescence device, a preparation method thereof and a display device. Background technique [0002] Flexible Organic Light-Emitting Diode (FOLED) has the advantages of self-luminous display, fast response, high brightness, and wide viewing angle. Moreover, FOLED is a display based on organic materials, without liquid filling, can be rolled, folded, and even worn, etc., which is a very good portable product. [0003] However, the current FOLEDs mostly use inorganic multilayer thin films (SiO x , SiN x ) for staggered stack packaging. However, the CVD film formation temperature of the inorganic film silicon nitride and silicon oxide is relatively high and will cause certain damage to the device and affect the performance of the device. Moreover, certain pinholes (pin holes) will be generated during the CVD process, which will affect the packaging effect...

AI Technical Summary

Problems solved by technology

However, the CVD film formation temperature of inorganic film silicon nitride and silicon oxide is relatively high and will cause certain damage to the device, affecting the performance of the device

And the CVD process will produce a certain pinhole (pin hole), which affects the packaging effect of the device

The aluminum oxide film is introduced to cover the pinholes generated in the CVD process, but because the inorganic film is too rigid, the flexible OLED device packaged with the inorganic film overlapping each other cannot be bent excessively, and certain cracks will occur after long-term stress bending

Therefore, the alternation of inorganic and organic has become a trend of OLED encapsulation, but the ability of blocking water and oxygen in many alternating modes is greatly reduced due to the insufficient affinity of organic and inorganic membrane surfaces.

In addition, in order to improve the light extraction efficiency of OLED devices, the mode of doping inorganic particles with organic materials is used, which also leads to poor flexibility due to insufficient interface affinity.

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