4results about How to "Improve high temperature reliability" patented technology

This invention discloses a molten salt pump with a bearing cooling system, belonging to the technical field of high-temperature molten salt pumps. It includes: a pump body, a pump shaft, a frame, a bearing housing, a cooling device, and a support frame. The pump body is mounted on the frame; the frame is mounted on the top of the pump body, and the bearing housing is mounted within the frame. The pump shaft is rotatably connected to the bearing housing via bearings. The cooling device is installed inside the bearing housing, with multiple microchannel coils respectively fitted onto the outer surface of the bearing. A flywheel energy storage device is installed inside the bearing housing, driving ambient air to enter through the air inlet and generating a forced airflow that blows across the cooling end of the cooling device for heat exchange. The cooling end of the cooling device is connected to a cold air inlet pipe, which is connected to multiple microchannel coils, and all microchannel coils are connected to an outlet pipe. An outlet is provided at the bottom of the bearing housing, and the outlet pipe is connected to the outlet. This invention miniaturizes and integrates a compressor-free cooling device into the bearing housing for active phase change cooling, extending the lifespan of the molten salt pump.

Provided is a pouch for a secondary battery and a lithium secondary battery including the same. The pouch for the secondary batter includes a barrier layer, a base material layer disposed on one surface of the barrier layer, and a sealant layer disposed on the other surface of the barrier layer. The sealant layer includes a first sealant layer in contact with the other surface of the barrier layer, and a second sealant layer disposed on the first sealant layer opposite to the barrier layer. The sealant layer has a melt flow rate (MFR) of about 14.0 g / 10 min or less, which is measured at a temperature of about 230°C under a load condition of about 2.16 kg.

The application belongs to the technical field of nanocomposites, and particularly relates to a kind of nano Cu@Sn powder and its preparation method and application. The preparation method of the nano Cu@Sn powder comprises the following steps: S1, under nitrogen protection, ammonia is added to an aqueous solution of copper salt, then a vinylpyrrolidone-vinyl acetate copolymer is added, the temperature is raised, an aqueous solution of hydrazine hydrate is added, stirring is continued, after the stirring is completed, the product is centrifuged under nitrogen protection, washed, and dried to obtain nano copper powder; S2, a complexing agent, a complexing agent, and an antioxidant are dissolved uniformly in a eutectic ionic liquid, nano copper powder is added, stirring is performed until the nano copper powder is uniformly dispersed, a stannous chloride hydrochloride solution is added, stirring is continued, an EVA solution is added, stirring is continued, after the stirring is completed, the product is centrifuged, washed, and dried to obtain Cu@Sn powder. The solder prepared by the application has high mechanical strength of solder joints and excellent high-temperature reliability.

This application relates to a heat dissipation substrate and its manufacturing method, a power semiconductor module, and a power converter. Embodiments relate to a heat dissipation substrate for power semiconductors, a power semiconductor module including the same, a power converter including the same, and a manufacturing method thereof. The method for manufacturing a heat dissipation substrate for power semiconductors according to an embodiment may include the following steps: preparing a first ceramic substrate; forming a bonding metal layer having a first thickness by sputtering on one or another surface of the first ceramic substrate; disposing a metal plate on the first ceramic substrate on which the bonding metal layer can be formed; and performing a hot pressing process while disposing the metal plate. In the hot pressing process step, the bonding metal layer may react with the first ceramic substrate to become an oxide bonding layer.