Preparation method of high thermal conductivity phase change temperature control composite packaging substrate

Abstract

The invention discloses a preparation method of a high thermal conductivity phase change temperature control composite packaging substrate, wherein, a low-melting-point alloy solid phase change material is integrated directly into an LTCC-ALN composite substrate and a phase change temperature control device with high integration and high thermal conductivity is formed. The invention is realized bythe following technical scheme: a phase change temperature control cavity is produced on the middle AlN green ceramic plate of the multi-layer AlN green ceramic plate, and then the aluminum nitride AlN substrate embedded with the sandwich of the phase change temperature control cavity is formed by laminated isostatic pressing and co-firing; matrix-distributed electronic component mounting cavities are fabricated on the LTCC green ceramic substrate, and then the AlN substrate and the LTCC green ceramic substrate are laminated and co-fired to form the LTCC-AlN composite substrate in which an electronic active device can be embedded. At last, solid phase change material of the low melting point alloy is heated and melted into the liquid state and poured into the phase change temperature control cavity of the composite substrate, and the phase change temperature control composite substrate with high thermal conductivity is prepared by sealing a cover plate.

Description

technical field [0001] The invention relates to a semiconductor refrigerator, electronic heater, high-power power semiconductor module, power control circuit, power mixing circuit, intelligent power component, automotive electronics, aerospace and military electronic components, solar panel components, laser A number of methods for preparing high thermal conductivity composite substrates embedded with phase change materials in the field of industrial electronics, especially related to the structure and preparation method of a high thermal conductivity composite substrate embedded with phase change materials. Background technique [0002] With the development of electronic equipment in the direction of high power, miniaturization, and high integration, the heat flux density of high-performance equipment has increased sharply at this stage, and the power consumption and density of electronic components, especially chips, per unit volume of electronic products are increasing. T...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a high integration, high thermal conductivity, which can directly integrate phase change materials, aiming at the shortcomings of the existing phase change temperature control device, such as large thermal resistance between different materials, and difficulty in further reducing volume and weight. Preparation method of high thermal conductivity composite substrate with phase change temperature control in circuit substrate

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