Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Inter-layer bonding sheet for multi-layer board and preparation method and application of inter-layer bonding sheet

A technology of multi-layer boards and adhesive sheets, which is applied in the fields of application, chemical instruments and methods, coatings, etc., can solve the problem of difficulty in meeting the process requirements and use requirements of printed circuit boards, and the poor reliability of heat resistance of PTFE multi-layer board bonding , poor bonding performance between fluororesin and film materials, etc., to meet the needs of high-frequency signals, stability, fluidity and bonding performance, and strong interlayer bonding

Active Publication Date: 2021-03-23
GUANGDONG SHENGYI SCI TECH
View PDF12 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] During the development of PTFE multilayer boards to higher performance and higher frequencies, researchers found that although prepregs based on thermosetting resins such as epoxy have good bonding performance, their dielectric constant and dielectric loss tangent are relatively high. Insufficient frequency characteristics, unable to meet the requirements of high-frequency signals; polyolefin resin has low dielectric loss tangent, but poor resistance, it is difficult to meet the process requirements and use requirements of printed circuit boards; and the use of fluorine-containing resin prepared Although the prepreg overcomes some of the defects in dielectric properties and resistance, the bonding performance between the fluororesin and the film material is not good, and there will be stratification and blistering at high temperature, which makes the heat resistance of the PTFE multilayer board bonded poor. , cannot meet the subsequent application requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0072] (1) the PTFE substrate with a thickness of 0.5mm is cleaned with acetone, degreased, and dried; then it is placed in a low-temperature plasma generator, and the setting voltage is 3000V, the system vacuum is 155Pa, and the radio frequency power is 1kW. in N 2 、H 2 In the mixed atmosphere (N 2 、H 2 The volume ratio is 8:2) take out after processing 600s, obtain the PTFE substrate after surface plasma treatment;

[0073] (2) The upper and lower surfaces of the PTFE substrate after the surface plasma treatment obtained in step (1) are roll-coated with dielectric resin treatment solution I respectively to obtain a dielectric resin layer with a thickness of 25 μm on the upper and lower surfaces, and solidify at 180° C. for 2.5 h , to obtain the interlayer adhesive sheet for the multilayer board.

Embodiment 2

[0075] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0076] (1) the PTFE substrate with a thickness of 0.9mm is cleaned with ethanol, degreased, and dried; then it is placed in a low-temperature plasma generator, and the setting voltage is 3000V, the system vacuum is 560Pa, and the radio frequency power is 3kW, In Ar, H 2 In a mixed atmosphere (Ar, H 2 The volume ratio is 9:1) and taken out after 240s treatment to obtain the PTFE substrate after surface plasma treatment;

[0077] (2) The upper and lower surfaces of the PTFE substrate after the surface plasma treatment obtained in step (1) are respectively roll-coated with dielectric resin treatment liquid I to obtain a dielectric resin layer with a thickness of 40 μm on the upper and lower surfaces, and solidify at 210°C for 2h. The interlayer adhesive sheet for the multilayer board was obtained.

Embodiment 3

[0079] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0080] (1) the PTFE substrate with a thickness of 1.3mm is cleaned with ethanol, degreased, and dried; then it is placed in a low-temperature plasma generator, and the setting voltage is 6000V, the system vacuum is 1224Pa, and the radio frequency power is 5kW, Take it out after being treated in an Ar atmosphere for 60s to obtain a PTFE substrate after surface plasma treatment;

[0081] (2) the upper and lower surfaces of the PTFE substrate after the surface plasma treatment obtained in step (1) are roll-coated with dielectric resin treatment solution I respectively to obtain a dielectric resin layer with a thickness of 50 μm on the upper and lower surfaces, and solidify at 200° C. for 3 h, The interlayer adhesive sheet for the multilayer board was obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an inter-layer bonding sheet for a multi-layer board and a preparation method and application of the inter-layer bonding sheet. The inter-layer bonding sheet for the multi-layerboard comprises a PTFE substrate and a dielectric resin layer bonded to the surface of the PTFE substrate. The PTFE substrate is a PTFE substrate of which the surface is subjected to plasma treatment, and the surface treatment depth of the PTFE substrate is 5-15nm. After the surface of the PTFE substrate is subjected to plasma treatment, functional modification is achieved, wettability is remarkably improved, and the PTFE substrate can be stably bonded with the dielectric resin layer in a high-strength mode. According to the inter-layer bonding sheet for the multi-layer board, through the synergistic cooperation of the PTFE substrate with the surface subjected to plasma treatment and the dielectric resin layer, the inter-layer bonding sheet for the multi-layer board has excellent dielectric property, fluidity and bonding strength, the bonding stability is high, and the signal high-frequency requirement and the stability and reliability requirements of the multi-layer board can be fully met.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and in particular relates to an interlayer bonding sheet for a multilayer board, a preparation method and application thereof. Background technique [0002] The rapid development of the information industry, advanced communication equipment and technology puts forward new performance requirements for high-frequency electronic equipment widely used in the communication field. Electronic circuit substrates for signal transmission are also bound to face a transition to high-frequency and high-speed characteristics. In the process of high-frequency and high-speed development of electronic circuit substrates, it is particularly critical to select a material with excellent electrical properties. The dielectric constant and dielectric loss tangent of polytetrafluoroethylene (PTFE) are small, and the aging resistance and high resistance It has good low temperature performance and is an ide...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08J7/04C08J7/12C08L27/18C09D123/16C09D147/00C09D109/06C09D171/12B32B7/12B32B27/08B32B27/32H05K1/03
CPCC08J7/123B32B27/08B32B7/12B32B27/322H05K1/036B32B2457/00C08J2327/18C08J2423/16C08J2447/00C08J2409/06C08J2471/12
Inventor 苏民社周如金梁伟郭浩勇
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com