Pinboard structure using conducting resin as signal return plane and preparation method thereof

Abstract

The invention provides a pinboard structure using conducting resin as a signal return plane. The pinboard structure using the conducting resin as the signal return plane comprises a substrate and through holes penetrating through the substrate, an insulating medium layer is formed on the front surface and / or the back surface of the substrate, metal interconnection structures are distributed in the insulating medium layer, each metal interconnection structures comprise at least one layer of horizontal interconnection structure, the metal interconnection structures are connected with the conducting materials inside the through holes, at least one conducting resin layer is arranged inside the insulating medium layer, and primary through holes are formed in the conducting resin layer for the metal interconnection structures to penetrate through the conducting resin layer without contacting with the conducting resin layer. The conducting resin layer and the horizontal interconnection structure of the metal interconnection structures are in different layers, and the conducting resin layer is in electric insulation with the metal interconnection structures. The pinboard structure using the conducting resin as the signal return plane is used for providing signal return paths of the pinboard.

Description

technical field [0001] The invention relates to an adapter plate structure and a preparation method, in particular to an adapter plate structure and a preparation method for a signal return plane used for system-level three-dimensional packaging. Background technique [0002] With the development of high-density and miniaturized integrated circuits, the difficulty of the process has increased sharply, and the problem of signal delay has become increasingly serious. The continuation of "Moore's Law" has been severely restricted. The development of three-dimensional integrated circuits is driven by the strong demand for high frequency, high speed, multifunctional, high performance, small size, high reliability and multifunctional electronic devices. Through three-dimensional integration, multi-chip stacking can be realized in all xyz directions. [0003] A key technology of three-dimensional packaging is the use of interposer boards containing through-silicon vias (TSV) to im...

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem of difficulty in setting the signal return path of the existing adapter board, the present invention provides a three-dimensional adapter board structure and preparation method in which conductive glue is used as the signal return plane. The adapter board structure can be used for all signal lines including high-speed Signal lines provide an efficient and complete signal return plane (i.e. return path)

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