Interlayer bonding sheet for multilayer board as well as preparation method and application of interlayer bonding sheet

A multi-layer board and bonding sheet technology, applied in the direction of multi-layer circuit manufacturing, coating, printed circuit manufacturing, etc., can solve the problem of poor heat resistance reliability of PTFE multi-layer board bonding, and poor bonding performance between fluororesin and film materials. It can meet the needs of high frequency signals, as well as good stability, fluidity and bonding performance, and low dielectric constant and dielectric loss tangent.

Active Publication Date: 2021-03-05
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] During the development of PTFE multilayer boards to higher frequency and higher performance, people gradually found that although prepregs based on thermosetting resins such as epoxy have good bonding performance, their dielectric constant and dielectric loss tangent are relatively high. Insufficient frequency characteristics, unable to meet the requirements of high-frequency signals; and...

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  • Interlayer bonding sheet for multilayer board as well as preparation method and application of interlayer bonding sheet
  • Interlayer bonding sheet for multilayer board as well as preparation method and application of interlayer bonding sheet

Examples

Experimental program
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Embodiment 1

[0069] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0070] (1) The PTFE substrate with a thickness of 0.5mm is cleaned with acetone, degreased, and dried; then it is soaked in the sodium naphthalene solution under the dry nitrogen protection atmosphere, and the concentration of the sodium naphthalene solution is 0.8mol / L, soaked Take it out after 280s, wash and dry with ethanol and distilled water respectively, and obtain the PTFE substrate after surface treatment;

[0071] (2) Roll-coat dielectric resin treatment solution I on the surface-treated PTFE substrate obtained in step (1) to obtain a dielectric resin layer with a thickness of 40 μm, and cure it at 210° C. for 2 hours to obtain the interlayer for the multilayer board. Adhesive sheet.

Embodiment 2

[0073] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0074] (1) Clean the PTFE substrate with a thickness of 1.0mm with ethanol, remove oil stains, and dry it; then soak it in the sodium-naphthalene solution under the atmosphere of dry nitrogen protection, the concentration of the sodium-naphthalene solution is 3mol / L, soak for 100s After taking out, wash with acetone, distilled water respectively, dry, obtain the PTFE substrate after the surface treatment;

[0075] (2) Roll-coat dielectric resin treatment solution I on the surface-treated PTFE substrate obtained in step (1) to obtain a dielectric resin layer with a thickness of 35 μm, and cure at 230°C for 1.5h to obtain the layer for the multilayer board Adhesive sheet between.

Embodiment 3

[0077] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0078] (1) The PTFE substrate with a thickness of 1.4mm is cleaned with ethanol, degreased, and dried; then it is soaked in the sodium naphthalene solution under a dry nitrogen protection atmosphere, the concentration of the sodium naphthalene solution is 8mol / L, and soaked for 60s After taking out, wash with ethanol, distilled water respectively, dry, obtain the PTFE substrate after the surface treatment;

[0079] (2) Roll-coat dielectric resin treatment solution I on the surface-treated PTFE substrate obtained in step (1) to obtain a dielectric resin layer with a thickness of 55 μm, and cure at 220°C for 1.5h to obtain the layer for the multilayer board Adhesive sheet between.

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Abstract

The invention provides an interlayer bonding sheet for a multilayer board and a preparation method and application of the interlayer bonding sheet. The interlayer bonding sheet for the multilayer board comprises a PTFE substrate and a dielectric resin layer bonded to the surface of the PTFE substrate; the PTFE substrate is a PTFE substrate of which the surface is treated by a sodium naphthalene solution, and the surface treatment depth of the PTFE substrate is 0.5-2 microns; after the surface of the PTFE substrate is treated by a sodium naphthalene solution, the wettability is remarkably improved, and the PTFE substrate can be stably bonded with the dielectric resin layer in a high-strength manner. The interlayer bonding sheet for the multilayer board has excellent dielectric property, flowability and bonding strength through the synergistic cooperation of the PTFE substrate with the surface treated by the sodium naphthalene solution and the dielectric resin layer, is high in bonding stability, can fully meet the signal high-frequency requirement and the stability and reliability requirements of the multilayer board, and has bright application prospect.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and in particular relates to an interlayer bonding sheet for a multilayer board, a preparation method and application thereof. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information communication equipment and computers, in order to transmit and process large-capacity information, operating signals tend to be high-frequency, so new materials for circuit boards have been proposed. Require. With the multi-functional development of high-frequency circuits, the multi-layering of high-frequency circuits is becoming more and more common. Polytetrafluoroethylene (PTFE for short) printed circuit boards are used as components in high-frequency circuits. An important part also needs to be multi-layered. However, since PTFE resin has almost no fluidity and cohesiveness, it is difficult to be used as a bonding ...

Claims

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Application Information

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IPC IPC(8): C08J7/04C08J7/12C08L27/18C08K7/14C09D147/00C09D123/16C09D7/61C09D125/10C09D171/12H05K3/46
CPCC08J7/12C09D147/00C09D7/61C09D125/10H05K3/4611C08J2327/18C08J2423/16C08J2447/00C08J2425/10C08J2471/12C08K7/14C08L23/16C08K3/36C08L71/12
Inventor 苏民社周如金梁伟郭浩勇
Owner GUANGDONG SHENGYI SCI TECH
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