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Inter-layer bonding sheet for multi-layer board and preparation method and application of inter-layer bonding sheet

A multi-layer board and bonding sheet technology, which is applied in multi-layer circuit manufacturing, coating, printed circuit manufacturing, etc., can solve the problems of poor heat resistance reliability, high dielectric constant, and high peel strength of PTFE multi-layer board bonding , to meet the needs of high frequency signals and stability, low dielectric constant and dielectric loss tangent, good chemical resistance and mechanical properties

Active Publication Date: 2021-03-23
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] CN109760398A discloses a combination method of fluorine-containing resin prepregs for high-frequency copper-clad laminates, which specifically includes the steps of baking glass fiber cloth, preparing fluorine-containing resin impregnating solution, immersing glass fiber cloth in fluorine-containing resin impregnating solution, plasma activation and pressing, etc. It solves the problem that when light and thin copper foil is used for lamination, the copper clad laminate produced by the existing fluorine-containing resin copper clad laminate production process has high hygroscopicity, high dielectric constant, high transmission loss, high peel strength of the product, and poor adhesion. Poor performance, prone to the problem of copper peeling off
[0007] However, in the prior art, although the prepregs based on thermosetting resins such as epoxy have good bonding performance, their dielectric constant and dielectric loss tangent are relatively high, and their high-frequency characteristics are not sufficient, so they cannot meet the requirements of high-frequency signals; polyolefin The dielectric loss tangent of the resin is low, but the resistance is not good enough to meet the process requirements and usage requirements of printed circuit boards.
Although the fluorine-containing resin prepreg overcomes some of the defects in dielectric properties and resistance, the bonding performance between the fluorine resin and the membrane material is not good, and there will be stratification and foaming at high temperatures, which makes the PTFE multilayer board bonded and resistant. Poor thermal reliability; plasma treatment can improve the adhesion of PTFE multilayer board, but the timeliness of this improvement is poor, which increases the time limit of the preparation process, and also cannot meet the subsequent application requirements

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  • Inter-layer bonding sheet for multi-layer board and preparation method and application of inter-layer bonding sheet
  • Inter-layer bonding sheet for multi-layer board and preparation method and application of inter-layer bonding sheet

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Experimental program
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Effect test

Embodiment 1

[0089] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0090] (1) Preparation of modified PTFE substrate: the PTFE substrate with a thickness of 0.9mm is cleaned and dried with ethanol; then it is placed in a low-temperature plasma generator, and the setting voltage is 3000V, and the vacuum degree of the system is 560Pa. RF power is 3kW, in Ar, H 2 In a mixed atmosphere (Ar, H 2The volume ratio is 9:1) and treated for 240s; placed in the air for 10min, then immersed in glycidyl methacrylate containing 0.002mol / L diethylpropylbenzene peroxide, graft polymerization at 130°C for 40min under nitrogen protection , to obtain a modified PTFE substrate;

[0091] (2) Place the modified PTFE substrate obtained in step (1) for 28 days, then roll-coat dielectric resin treatment solution I on the upper and lower surfaces respectively to obtain a dielectric resin layer with a thickness of 25 μm on the upper and ...

Embodiment 2

[0093] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0094] (1) Preparation of modified PTFE substrate: the PTFE substrate with a thickness of 0.5mm is cleaned and dried with acetone; then it is placed in a low-temperature plasma generator, and the setting voltage is 3000V, and the system vacuum is 155Pa. RF power is 1kW, at N 2 , H 2 In the mixed atmosphere (N 2 , H 2 The volume ratio is 8:2) and treated for 600s; placed in the air for 10min, then immersed in acrylic acid containing 0.004mol / L dibenzoyl peroxide, and grafted and polymerized at 90°C for 140min under the protection of nitrogen to obtain modified PTFE Substrate;

[0095] (2) The modified PTFE substrate obtained in step (1) was placed for 5 days, and then the upper and lower surfaces were roll-coated with dielectric resin treatment solution I to obtain a dielectric resin layer with a thickness of 40 μm on the upper and lower surfa...

Embodiment 3

[0097] This embodiment provides an interlayer bonding sheet for a multilayer board, the preparation method of which is as follows:

[0098] (1) Preparation of modified PTFE substrate: the PTFE substrate with a thickness of 1.3mm is cleaned and dried with ethanol; then it is placed in a low-temperature plasma generator, and the setting voltage is 6000V, and the system vacuum is 1224Pa. RF power is 5kW, treated in Ar atmosphere for 60s; placed in air for 10min, then immersed in methyl methacrylate containing 0.006mol / L dibenzoyl peroxide, grafted and polymerized at 105°C for 70min under nitrogen protection , to obtain a modified PTFE substrate;

[0099] (2) The modified PTFE substrate obtained in step (1) was placed for 20 days, and then the upper and lower surfaces were roll-coated with dielectric resin treatment solution I to obtain a dielectric resin layer with a thickness of 50 μm on the upper and lower surfaces, and cured at 210 ° C for 3 hours. , to obtain the interlayer ...

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Abstract

The invention provides an inter-layer bonding sheet for a multi-layer board and a preparation method and application of the inter-layer bonding sheet. The inter-layer bonding sheet for the multi-layerboard comprises a modified PTFE substrate and a dielectric resin layer bonded to the surface of the modified PTFE substrate. The modified PTFE substrate is a modified PTFE substrate of which the surface is subjected to plasmon and monomer graft polymerization treatment. A long-time-efficiency activation layer is formed on the PTFE substrate through the synergistic cooperation of plasma treatmentand monomer graft polymerization treatment, the activation property of the activation layer can be kept for 30 days, and the requirements of a manufacturing process and the requirements on product performance are fully met. According to the inter-layer bonding sheet for the multi-layer board provided by the invention, through the synergistic cooperation of the modified PTFE substrate and the dielectric resin layer, the dielectric property, the bonding strength, the mechanical property and the resistance are good, the bonding stability of the multi-layer board containing the inter-layer bondingsheet for the multi-layer board at high temperature is high, and the requirements of the multi-layer board for high frequency of signals, stability and reliability can be fully met.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and in particular relates to an interlayer bonding sheet for a multilayer board, a preparation method and application thereof. Background technique [0002] A printed circuit board (Printed Circuits Board, PCB) is an electrical structural element formed by insulating matrix materials supplemented by conductor wiring, and is used to provide electronic components such as transistors, diodes, bulk circuits, passive components and other electronic components for installation and The main support body during plugging has become an indispensable component for most electronic products to achieve circuit interconnection. With the wide application of integrated circuits, the high performance of electronic products is constantly promoting the development of the PCB industry, and PCBs are bound to face a continuous transformation to high-frequency and high-speed characteristics. In the proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/18C08J7/04C08L27/18C08K7/14C09D147/00C09D123/16C09D7/61C09D125/10C09D171/12H05K3/46
CPCC08J7/18C09D147/00C09D7/61C09D125/10H05K3/4611C08J2327/18C08J2447/00C08J2423/16C08J2425/10C08J2471/12C08K7/14C08L23/16C08K3/36C08L71/12
Inventor 苏民社周如金梁伟郭浩勇
Owner GUANGDONG SHENGYI SCI TECH
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