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Composition for forming adhesive film, adhesive film for processing prior to photo-curing, adhesive film, and electronic paper display device

A technology for bonding films and compositions, applied in the direction of adhesive types, polyether adhesives, film/sheet adhesives, etc. performance degradation, etc., to achieve excellent high temperature reliability and excellent chemical resistance.

Active Publication Date: 2016-05-11
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to this structure, the above-mentioned sealing film is in contact with the above-mentioned solvent, and the chemical resistance of the adhesive composition forming the sealing film to the solvent is lowered, and as a result, there is a problem that the high-temperature reliability and durability of the electronic paper are lowered.

Method used

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  • Composition for forming adhesive film, adhesive film for processing prior to photo-curing, adhesive film, and electronic paper display device
  • Composition for forming adhesive film, adhesive film for processing prior to photo-curing, adhesive film, and electronic paper display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] The weight-average molecular weight is 52000g / mol, and glass transition temperature is that the phenoxy thermosetting resin of about 94 ℃ dissolves PKHH (trade name) of Inchem Company in methyl cellosolve with 30 weight percent concentration solution, and with 300 mesh The phenoxy solution (P1) was prepared by filtration. Stir and mix the above-mentioned phenoxy solution (P1) of 22.0 g (wherein PKHH content: 6.6 g), S-28 (bis-(3,4-ring Oxycyclohexyl) adipic acid), 0.06g of isocyanate curing agent MFA-75X produced by Asahi Kasei Co., Ltd. and 2.3g of cationic photoinitiator UVI-6974 (Momentive) are prepared by the company, including triarylsulfonium hexafluoroantimonite as the main component) to prepare a composition for forming an adhesive film.

[0114] On the polyethylene terephthalate release film, the above composition is formed into a coating layer with a thickness of 10 μm, and then dried with hot air at 140°C for 3 minutes to prepare an adhesive for processing b...

Embodiment 2

[0117] In Example 2, an adhesive film was formed in the same manner as in Example 1, except that the glass transition temperature of the phenoxy resin was changed and used.

[0118]The weight-average molecular weight is 60000g / mol, glass transition temperature is that the phenoxy thermosetting resin of about 98 ℃ dissolves the PKFE (trade name) of Inchem company in methyl cellosolve with 30 weight percent concentration solution, and with 300 mesh Filter and prepare the phenoxy solution (P2). Stir and mix the above-mentioned phenoxy solution (P2) of 22.0 g (wherein PKHH content: 6.6 g), S-28 (bis-(3,4-ring Oxycyclohexyl) adipic acid), 0.06g of isocyanate curing agent MFA-75X produced by Asahi Kasei Co., Ltd. and 2.3g of cationic photoinitiator UVI-6974 (Momentive) are prepared by the company, including triarylsulfonium hexafluoroantimonite as the main component) to prepare a composition for forming an adhesive film.

[0119] On the polyethylene terephthalate release film, the...

experiment example 1

[0126] Experimental Example 1: Evaluation of Elution Amount

[0127] The adhesive film prepared in Examples 1-Example 2 and Comparative Example 1-Comparative Example 2 was mixed with a mixed solvent of halocarbon oil (Halocarbon Company halocarbon oil 0.8) and n-dodecane oil in a weight ratio of 3:7 After soaking in water for 12 hours, filter with a 300-mesh sieve, and dry at 110°C for 3 hours, measure the weight and measure the elution amount (X) [%] by the following calculation formula 2, and record it in Table 1 .

[0128] Calculation formula 2:

[0129] Elution amount (X) [%] = [(initial weight of adhesive film - weight of sealing film after immersion in solvent for a specified time) / initial weight of adhesive film] × 100

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Abstract

Provided is a composition for forming an adhesive film, comprising: a phenoxy-based thermosetting resin; a cyclic epoxy-based photo-curable compound; an isocyanate-based heat hardening agent; and a cationic photoinitiator.

Description

technical field [0001] The present invention relates to a composition for forming an adhesive film, an adhesive film for processing prior to photo-curing (Adhesive film for processing prior to photo-curing), an adhesive film and an electronic paper display device. Background technique [0002] In general, electronic paper displays (digital paper displays) are attracting attention as next-generation display devices next to liquid crystal displays (liquid crystal displays), plasma display panels (plasma display panels), and organic light-emitting devices (organic luminescence displays), and are evaluated as the most reflective display devices. The best ideal device. [0003] In particular, electronic paper (electronic paper) is a kind of display device that can display text or images by using a thin plastic substrate such as millions of beads splashed in oil holes, and can be played millions of times. In addition, it is expected to be used as a material to replace existing pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J171/10C09J163/00C09J7/00G02F1/167
CPCC09J163/00G02F1/167C08G59/4028C09J171/00C08G2650/56C08L63/00C08L71/00C09J7/30C09J11/00C09J2203/318
Inventor 金相还李勇勳金大贤崔源九金章淳
Owner LG CHEM LTD
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